Blog Review: Feb. 19

Cadence’s Ravi Vora explains the AMBA Local Translation Interface protocol, which defines the point-to-point protocol between an I/O device and the Translation Buffer Unit of an Arm System Memory Management Unit.

Siemens’ Stephen V. Chavez provides a checklist for ensuring the quality and functionality of a PCB at every stage, from design through fabrication, assembly, and testing, with a focus on layout solvability, performance, and manufacturability.

Synopsys’ Kin Wai Yip walks through the process of designing automotive interior lighting using light guides to create uniform illuminance and ambiance within the vehicle.

Arm’s Virginia Cangelosi breaks down the process of using AI to recreate songs with lyrics sung in a different language and compiles a pipeline of ML models to translate songs from English to Mandarin.

Ansys’ Ka-lip Chu investigates the relationship between safety analysis and systems engineering and points out the specific problems that engineers come up against when taking a traditional systems engineering approach to automotive safety.

Keysight’s Bla Sweeney suggests automated testing of product lifecycle management systems to ensure they are well integrated and working efficiently.

SEMI’s Jeana Harper-Kirkland and Richard Walker highlight a few of the contributions by Black inventors, scientists, and engineers, including a significant development for gaming consoles and strained-layer semiconductors for telecommunications.

Plus, check out the blogs featured in the latest Automotive, Security & Pervasive Computing, Test, Measurement & Analytics, and Low Power-High Performance newsletters:

Rambus’ Bart Stevens explores three major protocols designed to safeguard communications at different levels of the network stack.

Siemens’ Matthew Hogan explains how a shift left methodology can help achieve early reliability verification without simulation.

Synopsys’ Dana Neustadter looks at the importance of high-quality random numbers for preventing security breaches and maintaining data integrity.

Imagination’s Eleanor Brash digs into edge AI and how it enables real-time data processing, enhances operational efficiency, and drives predictive maintenance.

Infineon’s Isaac Ahn outlines the factors and modes that impact Bluetooth device throughput, such as connection interval and interference.

Onto Innovation’s Keith Best explains why photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.

PDF Solutions’ John Kibarian explores why the industry is turning to a system-level approach as cost per transistor scaling flattens.

Synopsys’ Sri Ganta and Hyoung-Kook Kim explain how the logical and physical optimization of DFT improves PPA.

Advantest’s Brent Bullock shows how to avoid catastrophic probe damage without incurring yield loss or unnecessary equipment downtime.

Power architect Barry Pangrle anticipates that the use of chiplet-based designs will expand beyond high-performance parts to the broader market.

Rambus’ Raj Uppala explains how compression enables the creation of a new memory tier that balances performance and cost.

Ansys’ Maura Callahan reports on an expert discussion about simulation process data management in product development and how it differs from PLM.

Cadence’s Nayan Gaywala digs into interrupt latency and context switching in multi-core designs.

Arm’s Diya Soubra shows how to enable devices to perceive and interpret their surroundings in a more sophisticated manner.

Siemens EDA’s Matthew Hogan presents a shift-left strategy for reliable IC design.

Quadric’s Steve Roddy checks out what vision language models are, why they matter, and what they can do.