Blog Review: Jan. 29

Cadence’s Reela Samuel looks beyond silicon to new semiconductor materials under development and the particular applications for gallium nitride, silicon carbide, indium phosphide, glass, and diamond.

Siemens’ Kyle Fraunfelter and Melville Bryant find that lean approaches alone cannot address the increasingly complex sustainability challenges of semiconductor manufacturing and call for the end-to-end digitalization provided by smart manufacturing.

Synopsys’ Michael Posner and Shekhar Kapoor predict that 50% of new HPC chip designs will be 2.5D or 3D multi-die in 2025 thanks to the maturation of advanced interconnects, manufacturing processes, and design tools.

Ansys’ Florian Menter explains the difference between laminar and turbulent flow and why predicting this critical fluid flow characteristic impacts everything from the noise a car makes to the fuel efficiency of an aircraft to the speed at which chemicals mix.

Arm’s Jacob Bramley digs into cache maintenance in self-modifying code and the use of the ‘__clear_cache’ function to synchronize the instruction and data caches.

Keysight’s Bla Sweeney explains the basics of agentic AI and the opportunities for using it in the software development lifecycle.

In a blog for SEMI, ATREG’s Stephen Rothrock presents three models that chip-reliant companies can implement to become less dependent on single sourcing and regain control over their supply chain at a lower cost.

Plus, don’t miss the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Amkor’s Chun Yuan Lim digs into new methods for cleaning roughened lead frames.

Synopsys’ Travis Brist looks at high-NA EUV challenges, such as stitching multiple exposures and mask synthesis.

Lam Research’s Wojciech (Wojtek) Osowiecki, Martyn Coogans, Saravanapriyan Sriraman, Rakesh Ranjan, Yu (Joe) Lu, and David M. Fried outline the benefits of digital twins for semiconductor R&D.

ASE’s Lihong Cao dives into package design challenges, including high density and complex connectivity.

Promex’s David Fromm explores ways to successfully integrate sensors, MEMS, and other components for new health care use cases.

SEMI’s Ana Bernardo reports on key discussions at the recent MEMS & Imaging Sensors Summit 2024, including implications for autonomous vehicles and wearables.