3D-IC trends and challenges; virtual prototypes for SDVs; chiplet security; sustainable AI development; quality best practices.
Siemens’ John McMillan provides a detailed overview of 3D-IC technology and heterogeneous integration, from the market trends driving its adoption to the design, verification, and manufacturing challenges involved.
Synopsys’ Gunnar Braun and Stewart Williams check out how cloud-based development practices and virtual prototypes can enable earlier and more efficient testing and validation for software-defined vehicles.
Cadence’s Moshiko Emmer warns that as chiplet adoption accelerates, security becomes a critical concern, requiring robust measures to protect data, IP, and system integrity.
Arm’s Maureen McDonagh urges sustainable practices across AI development, deployment, and usage to mitigate the environmental impacts of AI-driven energy consumption and associated greenhouse gas emissions.
Keysight’s Ben Miller highlights some of the challenges data centers face when transitioning to 800G and 1.6T Ethernet interconnects to support modern AI workloads.
Ansys’ Apurva Tiwari introduces a research effort to use hybrid quantum-classical workflows to accelerate computational fluid dynamics simulation.
SEMI’s Sarah Shen introduces the Quality Benchmarking Consortium, a new initiative dedicated to advancing quality best practices across the global semiconductor industry and addressing the challenges of qualifying increasingly complex systems.
Plus, don’t miss the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:
Tech strategy advisor Geoff Tate contends that TSMC’s leadership in AI data center logic chips is unstoppable, at least for now.
Lam Research’s Sandy Wen and Jacky Huang examine whether stress from creating and removing polysilicon sacrificial gates in finFETs can cause failures.
Microtronic’s Mike LaTorraca highlights how addressing problems early can reduce downtime in the fab and prevent reliability time bombs.
D2S’ Aki Fujimura digs into linearity correction and uniformity enhancement for Manhattan and curvilinear masks.
Synopsys’ Peter Barar zeroes in on identifying latent behaviors across different data sources.
ASE’s Louie Huang explains how effective collaboration across the supply chain is crucial for achieving carbon reduction goals.
SEMI contributor Kimberly Harrison pushes for traceability and provenance to combat conflict minerals and unfair labor practices.
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