Blog Review: Mar. 26

Siemens’ Bianca Ward argues that sustainability must be considered starting from the design phase to reduce the energy consumption of ICs as well as the production processes used to manufacture them.

Synopsys’ Adrien Tozzoli looks at how physical optics simulation can be improved by using beam synthesis propagation, a method that decomposes the optical field into a collection of beamlets to handle complex systems where ray-based analysis cannot achieve the required accuracy.

Cadence’s Veena Parthan checks out the idea of morphing wings and the role advanced materials, CFD simulation, and physical AI play in creating aircraft that can adapt to changing flight conditions.

Keysight’s Hwee Yng Yeo explores some key challenges in 6G research, from uncovering specific channel behaviors to validating how these new frequencies, waveforms, and other capabilities will perform from the physical layer up to the higher-layer protocols.

Arm’s Michael Lu finds that while on-device AI creates enormous opportunities, the pace of change poses significant security challenges for consumer devices, especially for smartphones that collect vast amounts of personal user data.

Ansys’ Vincent Delafosse and Chris Wolfe explain why addressing noise, vibration, and harshness issues in electric motor design requires a multiphysics approach and introduce a guided workflow for simulating the coupling between the magnetic and mechanical domains.

In a blog for SEMI, Melissa Dahlin of Policy Equity Group argues that childcare should be an important part of workforce development and looks at how semiconductor companies can help ensure their childcare offerings align with employee needs.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Amkor’s Chin Joo Tan outlines a process that coats die and wire-bonded lead frames in an adhesion promoter to help ensure long-term reliability and performance.

Synopsys’ Saurabh Suryavanshi shows how to create synthetic data to train AI models that enable engineers to perform virtual fab runs.

Lam Research’s Daebin Yim explores a way to mitigate gate-induced drain leakage in DRAM by dividing the gate into sections with different electrical properties.

eBeam Initiative member Harry Levinson finds that high-NA EUV is making progress toward high-volume manufacturing while optical lithography is seeing continued advances.

Promex’s Dick Otte contends that glass substrates offer a valuable alternative for specific applications, even if they do not replace epoxy entirely.

Brewer Science’s Jessica Albright looks at PFAS used in the semiconductor industry and efforts to eliminate them from the supply chain.

ASE’s Mike Hung explains why active interposers with transistors will gradually replace passive interposers, driving the transition to vertical stacking.

SEMI’s Pushkar Apte and Melissa Grupen-Shemansky, and IBM’s Jim Sexton, investigate ways to unlock the full potential of AI, from algorithms and architecture to foundational silicon technologies.