Blog Review: May 14

Siemens’ Stephen V. Chavez finds that proper PCB high voltage spacing between conductive elements is key to reliability and understanding the principles of clearance (through-air spacing) and creepage (along-surface spacing) is critical.

Cadence’s Frank Ferro checks out how the new HBM4 standard boosts bandwidth and addresses key issues in the data center, including the growing size of LLM data sets, reliability, and memory efficiency.

Synopsys’ Shankar Krishnamoorthy chats with industry execs about how AI will change the workforce and why leaders need to carefully consider the roles their engineering teams play today and how they will change in the future.

Lam Research’s Timothy Yang simulates how ion beam etching can directionally etch away rough areas of the line and space resist pattern to improve line edge roughness and line width roughness.

Arm’s Christoffer Dall introduces the latest version of Arm’s Generic Interrupt Controller Architecture (GIC), which helps manage the communication between devices and processors and ensure that the right processor handles the right task at the right time, with important tasks getting priority.

Ansys’ Bernard Dion and Caty Fairclough introduce a digital engineering methodology for all industries and disciplines that provides guidance via processes throughout the entire project, from helping to set up and manage a project to applying digital engineering best practices, analyzing systems, and linking with simulation software as well as safety and compliance guidelines.

Keysight’s Heidi Garcia and Charles Seifert chat about what 1.6T Ethernet means for the future of AI data centers and why system-level validation is more important than ever.

SEMI’s Sungho Yoon argues that the typical cyclical structure of the semiconductor industry continues to offer a relevant lens through which to interpret the current uncertain market environment and that a close examination of raw material inventory trends is key to understanding the wafer market.

Plus, don’t miss the blogs featured in the latest Test, Measurement & Analytics newsletter:

Onto Innovation’s Al Gamble explains how precise measurements enable manufacturers to maintain yield and productivity of high-volume manufacturing.

PDF Solutions’ Christophe Begue provides highlights of Ming Zhang’s keynote at the TestConX 2025 conference, including the interplay between data, modeling, and infrastructure.

Synopsys’ Hari Mani discusses the benefits of distributed ATPG, which reduces run time down to less than two days and results in 1% to 2% higher fault coverage.

Siemens’ Lee Harrison digs into threat modeling and why a defense-in-depth solution is essential for creating safe, secure ICs for automotive applications.

Modus Test’s Jack Lewis emphasizes the importance of test socket performance for ensuring a successful product ramp and avoiding costly mistakes.

Teradyne’s Jeorge Hurtarte talks about how shift left and shift right strategies ensure that test coverage is balanced across the manufacturing flow.