Blog Review: Sept. 11

Defining power intent; KGD have new challenges in 3D-ICs; automating the coverage process; HPC and AI system TCO.

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Cadence’s Neha Joshi introduces the IEEE 1801 standard, also known as UPF (Unified Power Format), which offers a uniform framework for defining power domains, power states, and power intent to ensure consistency across diverse tools and phases of the design process.

Siemens’ John McMillan warns that known good die may not behave the same in 3D-ICs as they do standalone and suggests that multiphysics analysis is necessary to overcome challenges such as the new stresses created by 3D stacking.

Synopsys’ Taruna Reddy points out a case study from Nvidia that features test grading, unreachability analysis, and AI techniques to automate the coverage process, achieve faster coverage closure, and end up with higher overall coverage.

Ansys’ Wim Slagter finds that while much focus is on the initial capital cost of HPC and AI systems, the initial purchase cost typically accounts for only about half of the total expenses incurred over the system’s useful life, with the other half composed of maintenance and continuing functionality.

Keysight’s Michelle Tate provides an overview of oscilloscopes, including the signal characteristics that can be verified, the types of waveforms and signals that can be analyzed, the various types of oscilloscopes, and the key specifications to consider when choosing one for a specific application.

Arm’s Basma El Gaabouri finds that developers of software for edge systems face increasing complexity as hardware heterogeneity expands and provides an overview of ways to deploy workloads on hybrid systems through the use of a hybrid runtime.

SEMI’s Samer Bahou checks out why the semiconductor industry needs to reduce its use of per and polyfluoroalkyl substances (PFAS) and highlights an industry collaboration that facilitates prototyping, experimentation, and tests and measurements for newer, more sustainable alternatives.

And don’t miss the blogs featured in the latest Automotive, Security & Pervasive Computing and Test, Measurement & Analytics newsletters:

Rambus’ Adiel Bahrouch explains why it is crucial to establish a safe, secure, end-to-end ADAS and data processing system.

Synopsys’ Lorin Kennedy and BlackBerry QNX’s Jasmin Mulaosmanovic show how to transform telemetry data into insights that can extend a vehicle’s lifetime.

Cadence’s Steve Brown digs into the DoT’s new safety rules and how an ADAS reference chiplet design can shorten the development cycle.

Infineon’s Diana Car contends the electrification of rail infrastructure is essential for cutting CO2 emissions and hitting climate targets.

TXOne Network’s YenTing Lee delves into ransomware attacks and techniques, with tips on how companies can fortify their defenses.

Synopsys’ Nozar Nozarian explains why hyperscalers are turning to a new approach to deliver structural/scan test data.

Teradyne’s Jeorge Hurtarte shows how flexible test strategies enable companies to thrive in a landscape impacted by legislation, technology development, and a shifting talent pool.

Advantest’s Keith Schaub details the benefits of real-time corrective data analysis and adaptive decision-making support for driving innovation.



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