Blog Review: Sept. 4

Synopsys’ Jyotika Athavale and Randy Fish sit down with Google’s Rama Govindaraju and Microsoft’s Robert S. Chappell to discuss silent data corruption and why a solution will require chip designers and manufacturers, software and hardware engineers, vendors, and anyone involved in computer data to collaborate and take the issue seriously.

Siemens’ Karen Chow and Joel Mercier explain the relationship between reliability, electromigration, and IR drop and why they have a much bigger impact in modern IC designs with advanced process nodes.

Cadence’s Veena Parthan checks out how the principles of origami are used in spacecraft like the James Webb Space Telescope and the role computational fluid dynamics and finite element analysis play in creating compact, unfoldable structures.

Arm’s David Maidment investigates security challenges in the AI era with the PSA Certified 2024 report and finds that despite security concerns, a majority of respondents believe that the benefits of AI still outweigh the risks, but roughly only half of businesses have the basics covered when it comes to improving the security of their products and services.

In a video, Lam Research’s Harmeet Singh lays out the challenges facing 1,000-layer 3D NAND and how cryogenic etch technology enables improvements that increase the density and capacity of the storage and the speed of the data and output.

Keysight’s Matthew Borst finds that network communications is a vital aspect of grid modernization, enabling functionality like real-time monitoring that utilities can use to implement demand response programs and promote energy efficiency.

Ansys’ Prem Andrade walks through the digital engineering journey for an electric vertical takeoff and landing (eVTOL) aircraft, from mission planning and concept selection to design and operation.

SEMI’s Gity Samadi and Paul Semenza highlight the ongoing development of manufacturing tools and processes, materials, and test and reliability evaluation techniques for the growing field of flexible hybrid electronics, including the use of additive manufacturing processes for electronics packaging and system assembly, from die attach to flexible printed circuits.

Plus, check out the blogs featured in the latest Systems & Design newsletter:

Technology Editor Brian Bailey contends that systems companies need to work out where they add value with chiplets and what they should outsource.

Eliyan’s Ramin Farjadrad shows how to minimize the number of wires between dies with networking technology that allows data to move in both directions.

Siemens EDA’s Neel Natekar zeroes in on how to reduce over-design and determine exact margins with high-fidelity full-chip ESD verification.

Arteris’ Insaf Meliane explores a systematic approach to managing the intricate connections between numerous IP blocks.

Alphawave Semi’s David Kulansky outlines how linear pluggable optics and sophisticated SerDes offer a path to higher bandwidth with less power and latency.

Keysight’s Michele Robinson-Pontbriand explains why 6G represents a major shift in how the communications industry can approach sustainability.

Cadence’s Frank Ferro digs into memory options and how to get high bandwidth while still using standard packaging and PCB technology.

Synopsys’ Stelios Diamantidis shares insights from the Hot Chips conference, illustrating how ecosystem players are adapting to the challenges and opportunities of the AI era.