Scalable And Compact Multi-Bit CAM Designs Using FeFETs


A technical paper titled “SEE-MCAM: Scalable Multi-bit FeFET Content Addressable Memories for Energy Efficient Associative Search” was published by researchers at Zhejiang University, China, Georgia Institute of Technology, University of California Irvine, Rochester Institute of Technology, University of Notre Dame, and Laboratory of Collaborative Sensing and Autonomous Unmanned Systems of ... » read more

Chip Industry Talent Shortage Drives Academic Partnerships


Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Chip Industry Week In Review


By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

An Overview Of Current Projects In The Open Quantum Hardware Ecosystem With Recommendations 


A technical paper titled “Open Hardware in Quantum Technology” was published by researchers at Unitary Fund, Qruise, Technical University of Valencia, M-Labs Limited, Lawrence Berkeley National Laboratory, Fermi National Accelerator Laboratory, Sandia National Laboratories, IQM Quantum Computers, PASQAL, Quantonation, Michigan State University, Università di Camerino, Microsoft Quantum, an... » read more

Patterning With EUV Lithography Without Photoresists


A technical paper titled “Resistless EUV lithography: photon-induced oxide patterning on silicon” was published by researchers at Paul Scherrer Institute, University College London, ETH Zürich, and EPFL. Abstract: "In this work, we show the feasibility of extreme ultraviolet (EUV) patterning on an HF-treated Si(100) surface in the absence of a photoresist. EUV lithography is the leading ... » read more

Memory Technologies Key To Advancing AI Applications


Memory is an integral component in every computer system, from the smartphones in our pockets to the giant data centers powering the world’s leading-edge AI applications. As AI continues to rise in reach and complexity, the demand for more memory from data center to endpoints is reshaping the industry’s requirements and traditional approaches to memory architectures. According to OpenAI,... » read more

Latency Considerations For 1.6T Ethernet Designs


Since its 1980s debut with 10Mbps shared LANs over coaxial cables, Ethernet has seen consistent advancements, now with the potential to support speeds up to 1.6Tbps. This progression has allowed Ethernet to serve a wider range of applications, such as live streaming, Radio Access Networks and industrial control, emphasizing the importance of reliable packet transfer and quality of service. With... » read more

RISC-V Wants All Your Cores


RISC-V is no longer content to disrupt the CPU industry. It is waging war against every type of processor integrated into an SoC or advanced package, an ambitious plan that will face stiff competition from entrenched players with deep-pocketed R&D operations and their well-constructed ecosystems. When Calista Redmond, CEO for RISC-V International, said at last year's summit that RISC-V w... » read more

Arm A-Profile Architecture Developments 2023


As computing demands continue to evolve with the rise of artificial intelligence (AI) and advancing security threats, it is imperative that the foundational computing architecture at the heart of the world’s devices continues to evolve. This is why our engineering teams add new features and technologies to the pervasive Arm architecture, with the software teams then ensuring that software lan... » read more

Partitioning Processors For AI Workloads


Partitioning in complex chips is beginning to resemble a high-stakes guessing game, where choices need to extrapolate from what is known today to what is expected by the time a chip finally ships. Partitioning of workloads used to be a straightforward task, although not necessarily a simple one. It depended on how a device was expected to be used, the various compute, storage and data paths ... » read more

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