Newsletters Archive - Page 36 of 66 - Semiconductor Engineering


IoT, Security & Automotive – 08/01/2019


Top Stories Solving 5G's Thorniest Issues Incomplete roadmaps and continued uncertainty about millimeter-wave technology make this technology's uses hazy, but solutions are in the works. Where Should Auto Sensor Data Be Processed? An explosion in data and questions about how to best utilize it are slowing the rollout of autonomous vehicles. New Approaches For Hardware Security Experts... » read more

System Level Design – 07/25/2019


Top Stories Hardware-Software Co-Design Reappears There may be a second chance for co-design, but the same barriers also may get in the way. Hybrid Emulation Takes Center Stage Complex chips require a multitude of verification platforms working in sync, and that's where the challenges begin. How To Optimize Verification There's no such thing as a perfect strategy, but much can be impr... » read more

Manufacturing, Packaging & Materials – 07/18/2019


Top Stories 200mm Cools Off, But Not For Long New market opportunities, a push by SiC vendors to larger wafers and a shortage of used equipment are raising concerns across the industry. Challenges Grow For 5G Packages And Modules 5G wireless networks drive need for new IC packages and modules. Creating 2D Compounds Van der Waals heterostructure becomes a building block for physicists.... » read more

Low Power-High Performance – 07/16/2019


Special Report Power Is Limiting Machine Learning Deployments Rollouts are constrained by the amount of power consumed, and that may get worse before it gets better. Top Stories Low-Power Design Becomes Even More Complex New markets, technologies and tradeoffs that span multiple different disciplines are turning this into an increasingly difficult team effort. Will In-Memory Processing ... » read more

Test, Measurement & Analytics – 07/09/2019


Top Stories Silicon Photonics Begins To Make Inroads Maturing processes and new application areas open doors for extremely fast, low-power applications. Big Shifts In Big Data Why the growth of cloud and edge computing and the processing of more data will have a profound effect on semiconductor design and manufacturing. 5G OTA Test Not Ready For Production High-volume, production-read... » read more

IoT, Security & Automotive – 07/02/2019


Top Stories Edge Complexity To Grow For 5G Increased interdependence of technologies will drive different architectures and applications. Machine Learning Inferencing Moves To Mobile Devices TinyML movement pushes high-performance compute into much smaller devices. How To Automate Functional Safety Experts at the Table: With both established companies and new players clamoring to play... » read more

System-Level Design – 06/27/2019


Top Stories Open Source Processors: Fact Or Fiction? Calling an open-source processor free isn't quite accurate. Test Chips Play Larger Role At Advanced Nodes Opinions diverge about whether to use fewer test chips, or whether to put more diagnostics into those chips. Debugging Complex SoCs Experts at the Table, Part 1: Why time spent in debug is increasing, underlying trends, and what... » read more

Manufacturing, Packaging & Materials – 06/20/2019


Top Stories What's Next In Advanced Packaging Wave of new options under development as scaling runs out of steam. Possible Uses Narrow For Negative Capacitance FETs Why technology used in ferroelectric memory may not work in other types of devices. Sidestepping Moore's Law Why multi-die solutions are getting so much attention these days. Video Advanced Process Control How to eke an... » read more

Low Power High Performance – 06/13/2019


Special Report Why Chips Are Getting Noisier Even at older nodes with mostly digital circuitry, noise is a growing problem. Top Stories Waiting For Chiplet Interfaces Plug-and-play approaches are gaining mindshare, even if some of the key pieces are missing. HBM2 Vs. GDDR6: Tradeoffs In DRAM Experts at the Table, part 1: Choices vary depending upon application, cost and the need for ca... » read more

Test, Measurement & Analytics – 06/11/2019


Special Report Data Confusion At The Edge What happens when data is processed at uneven rates? Top Stories Inspection, Metrology Challenges Grow For SiC Defects, scale remain problematic, but new tools may help. 5G Drives New Test Approaches Lots of scans and testbeds, but not enough automation. Video Using ML For Post-Silicon Validation Why machine learning is so effective in impro... » read more

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