The Week in Review: IoT

By Jeff Dorsch - 13 Apr, 2018 - Comments: 0

Finance Palo Alto, Calif.-based Armis raised $30 million in Series B funding, bringing total funding for the provider of enterprise Internet of Things security to $47 million. Red Dot Capital Partners of Israel led the round, joined by Bain Capital Ventures. Existing investors Sequoia Capital and Tenaya Capital also participated in the latest funding, which Armis will use to expand sales and m... » read more

The Week in Review: IoT

By Jeff Dorsch - 08 Dec, 2017 - Comments: 0

Products/Services Vancouver, B.C.-based Riot Micro has brought out the RM1000 baseband modem chip for the cellular Internet of Things. The device is said to use Bluetooth Low Energy and Wi-Fi techniques to provide low-power and lower-cost connectivity, like short-range wireless systems. The chip is being marketed to module manufacturers and OEMs developing narrowband IoT and LTE-M products for... » read more

The Week in Review: IoT

By Jeff Dorsch - 01 Dec, 2017 - Comments: 0

Products/Services At this week’s AWS re:Invent conference in Las Vegas, Nevada, Amazon Web Services introduced a number of products and services for the Internet of Things, machine learning, and other areas. These include Amazon FreeRTOS (an operating system for IoT microcontrollers), AWS IoT Device Defender (security management), AWS IoT 1-Click, AWS IoT Device Management, AWS IoT Analytics... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: .406 Ventures

The Week in Review: IoT

The Week in Review: IoT

The Week in Review: IoT

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers
Entities, people and technologies explored