Time For FMEDA Reuse?

By Stefano Lorenzini - 07 Jul, 2022 - Comments: 0

How do designers quantify safety in electronic systems? Through one or more tables called Failure Modes, Effects and Diagnostic Analysis – FMEDA. In fact, an FMEDA does not have to be a table; it could be manifested in scripts or some other form, but a table is the easiest way to think of this information. Think of an FMEDA for an IP, as the concept extends easily to a system-on-chip (SoC). T... » read more

Power Management And Integration Of IPs In SoCs: Part 1

By Progyna Khondkar - 09 Apr, 2020 - Comments: 0

IPs – whether in the form of soft or hard macros – are the epicenter of today’s SoC designs. Integration of IP with low power designs and conducting power aware (PA) verification are always complex and cumbersome. Because most of these IPs are self-contained, pre-verified at the block level, and must be preserved in their totality when integrated or verified at the SoC level. Until UPF... » read more

How To Build An Automotive Chip

By Ann Mutschler - 07 Mar, 2019 - Comments: 0

The introduction of advanced electronics into automotive design is causing massive disruption in a supply chain that, until very recently, hummed along like a finely tuned sports car. The rapid push toward autonomous driving has changed everything. This year, Level 3 autonomy will begin hitting the streets, and behind the scenes, work is underway to design SoCs for Level 4. But how these chi... » read more

IP Requirements Changing

By Brian Bailey - 25 Feb, 2016 - Comments: 0

Twenty years ago the electronics industry became interested in the notion of formalizing re-use through third-party IP. It has turned out to be harder than anyone imagined. In 1996, the Virtual Socket Interface Alliance ([getentity id="22845" comment="VSIA"]) was formed to standardize the development, distribution and licensing of IP. Soon afterward, companies with a couple of people in a ga... » read more

IP Integration Challenges Rising

By Ann Mutschler - 24 Jul, 2014 - Comments: 0

It’s not just [getkc id="80" comment="lithography"] that is putting a crimp in sub-28nm designs. As more functions, features, transistors and software are added onto chips, the pressure to get chips out the door has forced chipmakers to lean more heavily on third-party IP providers. Results, as you might expect, have been mixed. The number of blocks has mushroomed, creating its own web of ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: soft IP

Time For FMEDA Reuse?

Power Management And Integration Of IPs In SoCs: Part 1

How To Build An Automotive Chip

IP Requirements Changing

IP Integration Challenges Rising