Week in Review: IoT, Security, Auto

By Jeff Dorsch - 29 Mar, 2019 - Comments: 0

Internet of Things Organizers for the Internet of Things World 2019 conference, coming up on May 13-16 in Santa Clara, Calif., surveyed more than 100 IoT leaders in various industries. Implementation (34%) and security (25%) were the highest concerns for the respondents. Those were followed by initial purchase (17%), scalability (10%), business buy-in (8%), and upkeep costs (3%). Two-thirds of... » read more

December ’18 Startup Funding: Big Rounds As 2018 Ends

By Jeff Dorsch - 03 Jan, 2019 - Comments: 0

During the month of December, 16 startups had private funding rounds of $100 million and up, with half of them in the mobility area. Those 16 rounds totaled $3.2 billion as the year concluded. Before the holidays, the SoftBank Vision Fund invested $500 million in Cambridge Mobile Telematics, provider of the DriveWell platform used by insurers, vehicle fleets, wireless carriers, and others to... » read more

Blockchain: Hype, Reality, Opportunities

By Susan Breidenbach - 04 Jan, 2018 - Comments: 4

Blockchain buzz has reached deafening levels, and its proponents say we haven’t heard anything yet. The blockchain-enabled transformations they describe make the Internet revolution look almost trivial. Critics argue that too many people drank the blockchain Kool-Aid. Outside the cryptocurrency arena, they say that blockchain amounts to little more than some really slick slideware. The ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: AIG

Week in Review: IoT, Security, Auto

December ’18 Startup Funding: Big Rounds As 2018 Ends

Blockchain: Hype, Reality, Opportunities