Week In Review: Design, Low Power

By Jesse Allen - 07 Jul, 2023 - Comments: 0

Worldwide semiconductor industry sales dropped 21% year-over-year in May to $40.7 billion, mostly driven by decreases in the Americas (-22%), Asia Pacific/All Other (-23%), and China (-29%). But there also were hints of a recovery. The three-month moving average showed a 1.7% increase in sales, with the largest increases in China (+3.9%) and Europe (+2%). “Despite continuing market sluggishne... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 17 Mar, 2023 - Comments: 0

North Americas’s first zero-emission hydrogen-powered “Train de Charlevoix” will start running in Canada this summer, with speeds up to 85 mph, only emitting water vapor. Germany rolled out the world’s first passenger train fleet in 2022. The U.S. Department of Energy announced the availability of $750 million for R&D to further clean hydrogen technologies, part of the Biparti... » read more

Week In Review: Design, Low Power

By Jesse Allen - 17 Mar, 2023 - Comments: 0

The UK government published its National Quantum Strategy, which outlines the plan to invest £2.5 billion (~$3.0 billion) over the next 10 years into quantum technology, including computing, sensing, timing, imaging, and networking. "We will develop UK strengths across different hardware platforms, software, and components, and reinforce our capabilities throughout the supply chains. Although ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Ashling

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power