Week in Review: IoT, Security, Auto

By Jeff Dorsch - 19 Apr, 2019 - Comments: 0

Internet of Things Combining artificial intelligence with unmanned aerial vehicles could provide a quicker and safer alternative to inspecting roadways for cracks, potholes, and other damage, according to a paper posted on arvix.org. “[M]anual visual inspection [is] not only tedious, time-consuming, and costly, but also dangerous for the personnel. Furthermore, the detection results are alwa... » read more

The Wearables Wave Expands Today’s Mobile Experience

By Andrew Frame - 10 Apr, 2014 - Comments: 1

By Andrew Frame and Bee Hayes-Thakore There’s no question that the mobile experience is expanding. Today’s smartphones, all powerful computing devices, have made it possible for us to stay connected to the information that matters most to us, offering at-a-glance information in a compact, portable form for extended periods of time. Most of us are always within easy reach of our smartphones... » read more

Big Changes Rock Global Smartphone Market

By Jeff Chappell - 25 Nov, 2013 - Comments: 0

BANGKOK — One of the many draws for Western travelers here in Thailand and throughout much of Asia, including China, is the availability of cheap consumer electronics. Unfortunately many of these electronic goods — little-known off-brands mimicking better-known counterparts, or white-label devices being passed off as name-brand products to unsuspecting consumers — typically are technologi... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Canalys

Week in Review: IoT, Security, Auto

The Wearables Wave Expands Today’s Mobile Experience

Big Changes Rock Global Smartphone Market