Week in Review: IoT, Security, Auto

By Jeff Dorsch - 10 Aug, 2018 - Comments: 0

Cybersecurity Jens (Atom) Steube, a cybersecurity researcher and creator of the Hashcat password cracking tool, was probing for vulnerabilities in the new WPA3 security standard for Wi-Fi routers. WPA3 presents a robust defense against hacking, yet Steube discovered a security flaw in routers using WPA/WPA2 – one that leaves Wi-Fi passwords enabled with Pairwise Master Key Identifiers vulner... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 27 Jul, 2018 - Comments: 1

Automotive Tech Marvell Technology Group opened its automotive electromagnetic compatibility lab in North America. The facility is CISPR 25-qualified and gives the chip company the capability to conduct in-house electrostatic discharge, emission, and immunity testing. Marvell also reported that its 88Q2112 offering received a mark of 100% in conformance testing outlined by the Japan Automotive... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 13 Jul, 2018 - Comments: 0

Deals ArterisIP inked a deal with Mobileye, which has bought multiple licenses for ArterisIP's interconnect and resilience technology for functional safety and AI hardware acceleration. Mobileye, which was purchased by Intel last year for $15.3 billion, will use the technology for ISO 26262/ASIL B and D SoCs. Siemens agreed to operate its MindSphere digital operating system on Alibaba Cloud... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Didi Chuxing

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto