Startup Funding: November 2023

By Jesse Allen - 06 Dec, 2023 - Comments: 0

November was a banner month for quantum computing startups, with two raising rounds of $100 million for their superconducting and silicon spin qubit technology. Another significant round went to a company developing photonic-based systems. Several other companies drew funding, including one applying quantum sensors to semiconductor inspection. Sizeable funding also went to an autonomous tran... » read more

Startup Funding: June 2021

By Jesse Allen - 07 Jul, 2021 - Comments: 0

June was the month of mega-rounds for autonomous driving companies, with three pulling in well over $100M. All three are based in China, but their products range from chips to full robotaxi services. Also in the automotive space, an EV battery manufacturer raised over $2B, a solid-state lidar developer drew $300M — and those are just the largest rounds. Plus, new HPC architectures, GAA metrol... » read more

August 2019 Startup Funding Report

By Jeff Dorsch - 09 Sep, 2019 - Comments: 0

Last month, 18 startups received private funding rounds of $100 million or more. Software and cybersecurity startups were once again popular, while automotive, mobility, artificial intelligence/machine learning, and agriculture-related technology also saw a good deal of funding. Analytics, energy, Internet of Things, and robotics startups drew new funding, too. Those 18 companies together to... » read more

Knowledge Centers
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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

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Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Draper Associates

Startup Funding: November 2023

Startup Funding: June 2021

August 2019 Startup Funding Report

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