Making Buildings Smarter

By Jeff Dorsch - 04 Oct, 2018 - Comments: 1

Calling a building “smart” implies that technology is embedded to make that building more efficient, useful, convenient and profitable. The goal is to program efficiency beyond what humans can provide. But “smart” also may imply a healthy dose of marketing hype. No one wants to live in a “dumb building,” but it's difficult to define what makes a building smart. And while much is ... » read more

The Week in Review: IoT

By Jeff Dorsch - 25 May, 2018 - Comments: 0

Finance Orbbec of Shenzhen, China, a developer of motion sensing technology, raised more than $200 million in Series D funding led by Ant Financial. Also participating in the new round were SAIF Financial, Green Pine Capital Partners, R-Z Capital, and Tianlangxing Capital Partners. Established in 2013, Orbbec develops 3D sensors for applications in facial recognition, gesture recognition, robo... » read more

The Week In Review: Design

By Jesse Allen - 25 May, 2018 - Comments: 0

Tools & IP Cadence and National Instruments are teaming up with the aim of improving the semiconductor development and test process. The two companies are jointly working on common transistor models to ensure consistent simulation behavior between NI AWR Microwave Office circuit design software and the Cadence Spectre simulation platform. Cadence also launched the Virtuoso RF Solution for ... » read more

Move Data Or Process In Place? (Part 2)

By Brian Bailey - 20 Nov, 2017 - Comments: 0

Chip architectures, and even local system architectures, long have found that the best way to improve total system performance and power consumption is to move memory as close to processors as possible. This has led to cache architectures and memories that are tuned for those architectures, as discussed in part 1 of this article. But there are several tacit assumptions made in these architectur... » read more

An Innovator’s Vision

By Brian Bailey - 28 Aug, 2017 - Comments: 1

I had the pleasure of talking with [getperson id="11764" comment="Lucio Lanza"], managing director of Lanza techVentures, when I was researching my article on design innovation earlier this month. One thing that sets successful business people apart is their ability to see patterns, to correctly identify how those patterns fit together and progress and, based on those, to know which way to evol... » read more

Is Design Innovation Slowing?

By Brian Bailey - 10 Aug, 2017 - Comments: 0

Paul Teich, principal analyst for Tirias Research, gave a provocative talk at the recent DAC conference entitled, "Is Integration Leaving Less Room for Design Innovation?" The answer isn't as simple as the question might suggest. "Integration used to be a driver for increasing the functionality of silicon," Teich said. "Increasingly, it will be used to incorporate more features of an entire ... » read more

Designing For The IoT

By Brian Bailey - 27 Jul, 2017 - Comments: 0

Each day of the Design Automation Conference (DAC) starts with a keynote. What was particularly noteworthy this year was that they all focused on some aspect of the [getkc id="76" comment="Internet of Things"] (IoT), and the value of hardware within the IoT. Semiconductor Engineering attended all of the keynotes. What follows are highlights of those talks, along with some analysis. (The four... » read more

IoT Myth Busting

By Brian Bailey - 13 Jul, 2017 - Comments: 0

The [getkc id="76" comment="Internet of Things"] (IoT) means many things to a large number of people, but one thing is clear—every discussion involving the IoT invariably includes some rather dramatic growth predictions for how many connected devices will be sold and who will be the primary beneficiaries. While that data helps spice up speeches, and typically gets people to read and quote ... » read more

The Week In Review: IoT

By Jeff Dorsch - 23 Jun, 2017 - Comments: 0

Finance Samsara, an Industrial Internet of Things startup, raised $40 million in its Series C financing, led by General Catalyst. Andreesen Horowitz, an existing investor, and Samsara’s founders also participated in the funding round, which values the company at $530 million. The supplier of Internet-connected sensors for industrial and transportation applications has raised a total of $80 m... » read more

Awesome Keynotes Show How Our Community Has Grown

By Michael MacNamara - 15 May, 2017 - Comments: 0

In case you missed it, we’ve announced our 2017 keynoters, a group that (including the luminaries giving SKY talks) gives you six more very good reasons be Austin the fourth week in June. All the information you need on the lineup is here. I know you are perhaps too busy to dig through this, so LMGTFY and share with you some highlights: ● Monday, Joe Costello, Chairman & CEO, Enlighted... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?