Ivy Tech Community College Semiconductor Engineering

Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging.

by Laura Peters

Global IC Fabs And Facilities Report: 2024

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.

by Liz Allan

Chip Architectures Becoming Much More Complex With Chiplets

Options for how to build systems increase, but so do integration issues.

by Ed Sperling and Ann Mutschler

DeepSeek: Improving Language Model Reasoning Capabilities Using Pure Reinforcement Learning

by Technical Paper Link

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance

by Technical Paper Link

Testing For Thermal Issues Becomes More Difficult

Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.

by Gregory Haley

Auto Chip Aging Accelerates In Hot Climates

New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.

by Ed Sperling

Is In-Memory Compute Still Alive?

It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.

by Bryon Moyer

GDDR7 Memory Supercharges AI Inference

High bandwidth and low latency are paramount for AI-powered edge and endpoints.

by Tim Messegee

Hybrid Bonding Makes Strides Toward Manufacturability

Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.

by Laura Peters

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