Startup Funding: Q3 2024

By Jesse Allen - 16 Oct, 2024 - Comments: 0

Numerous new companies burst on the scene in the third quarter of 2024, including startups with plans for customizable RISC-V-based IP for applications from microcontrollers to data centers, high-speed data center interconnects, compute-in-memory LLM inference chips, and surveillance camera SoCs. Although it did not report funding, AheadComputing also launched last quarter to develop RISC-V cor... » read more

Startup Funding: March 2022

By Jesse Allen - 04 Apr, 2022 - Comments: 0

Semiconductor manufacturing, test, and inspection equipment startups did well in March. Investors funded a wide variety of equipment companies, including test equipment, materials handling, and those that make parts and components. In the manufacturing space, several companies developing manufacturing execution systems received funding, as well as a startup trying to prevent counterfeit parts f... » read more

Startup Funding: April 2020

By Jesse Allen - 06 May, 2020 - Comments: 0

It was another strong month for automotive startups, with one autonomous trucking company in China drawing a massive $100M investment. Another hot area was optimization of machine learning deployments, including one new company launch. Quantum computing, etch equipment, and mmWave feature in this month's look at twenty-two startups that collectively raised $375M. Semiconductors & design ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NextLeap Ventures

Startup Funding: Q3 2024

Startup Funding: March 2022

Startup Funding: April 2020

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Entities, people and technologies explored