Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 06 Jan, 2023 - Comments: 0

This was a tough week for cybersecurity. Chinese researchers claim to have figured out a way to crack some of the most advanced security algorithms with only 372 physical qubits, versus millions of qubits as previously theorized. This can be used to both speed up quantum decryption and to create large integers that can withstand future attacks. If it proves out, that approach would significantl... » read more

Yield Is Top Issue For MicroLEDs

By Laura Peters - 11 Oct, 2022 - Comments: 0

MicroLED display makers are marching toward commercialization, with products such as Samsung’s The Wall TV and Apple’s smart watch expected to be in volume production next year or in 2024. These tiny illuminators are the hot new technology in the display world, enabling higher pixel density, better contrast, lower power consumption, and higher luminance in direct sunlight — while consu... » read more

Japan: Finding Leadership In New Technology Areas

By SEMI - 18 Jun, 2015 - Comments: 0

By Osamu Nakamura The semiconductor industry is a technology-driven industry — and technology invention and innovation are the engines that drive industry growth. Japan has seen the global landscape for semiconductor manufacturing change, and in turn, Japan’s semiconductor industry has been changing, finding technology leadership opportunities in emerging technology areas that lead to grow... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Nichia

Week In Review: Auto, Security, Pervasive Computing

Yield Is Top Issue For MicroLEDs

Japan: Finding Leadership In New Technology Areas

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers
Entities, people and technologies explored