Blog Review: May 15

By Jesse Allen - 15 May, 2019 - Comments: 0

Cadence's Sean Dart shares an example of the kind of optimizations HLS tools can perform that would be difficult to find and implement by hand-coding RTL. Synopsys' Taylor Armerding takes a look at three cybersecurity initiatives from the U.S. government, from an IoT bill to improved voting machines, and whether they're likely to work. In a video, Mentor's Colin Walls points to why flashi... » read more

MEMS & Sensors Technical Congress Focuses on Automotive, Emerging MEMS

By Heidi Hoffman - 08 Feb, 2019 - Comments: 0

This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards. The more technically focused of SEMI’s annual MEMS events, MSTC returns to Monterey, California, in conjunction with FLEX, the conference that highlights new form... » read more

The Week in Review: IoT

By Jeff Dorsch - 18 May, 2018 - Comments: 0

Conferences Keynote highlights from the Internet of Things World 2018 conference: “Safety is the most important thing,” said Russ Benson, vice president of IT product systems at Boeing; “It’s all about data,” said Juan Perez, chief information officer and chief engineering officer of UPS; “Semiconductors accelerate IoT growth,” said Tony Keirouz, vice president of IoT strategy, e... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: PNI Sensor

Blog Review: May 15

MEMS & Sensors Technical Congress Focuses on Automotive, Emerging MEMS

The Week in Review: IoT