Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 07 May, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Foxconn (also known as Hon Hai Technology Group) is forming a joint venture (JV) with Yageo Group, a component production and process management company for EVs and other high-end electronics, to focus on the development of semiconductors under $2 USD, which they call “small ICs.” Through the JV, a new company called XSemi wil... » read more

Week In Review: IoT, Automotive, Security

By Susan Rambo - 20 Dec, 2019 - Comments: 0

Automotive/Mobility Synopsys and Porsche Consulting, a management consultancy that grew out of Porsche’s automotive expertise, have collaborated on a framework for accelerating the development of automotive SoCs, using automotive IP. The process includes Synopsys' Triple Shift-Left — a which uses virtual prototyping and automotive IP to test software and hardware in the design stage — an... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 06 Sep, 2019 - Comments: 0

Products/Services Rambus entered an exclusive agreement to acquire the Silicon IP, Secure Protocols, and Provisioning business from Verimatrix, formerly known as Inside Secure. Financial terms were not revealed. The transaction is expected to close this year. Rambus will use the Verimatrix offerings in such demanding applications as artificial intelligence, automotive, the Internet of Things, ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 16 Nov, 2018 - Comments: 0

Internet of Things Gartner identified what it says are the top 10 strategic Internet of Things technologies and trends. Number one, no surprise, is artificial intelligence. Nick Jones, research vice president at Gartner, said in a statement, “AI will be applied to a wide range of IoT information, including video, still images, speech, network traffic activity, and sensor data.” Other top t... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: PSA Group

Week In Review: Auto, Security, Pervasive Computing

Week In Review: IoT, Automotive, Security

Week in Review – IoT, Security, Autos

Week in Review: IoT, Security, Auto

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Knowledge Centers
Entities, people and technologies explored