Startup Funding: January 2024

By Jesse Allen - 07 Feb, 2024 - Comments: 0

Big rounds marked January, with three companies raising over $100 million. Quantum computing topped the list, with the company that resulted from the merger of Cambridge Quantum Computing and Honeywell's quantum division raking in the third-largest round for a quantum computing company ever. Another chart-topper was an advanced packaging company that began mass production in its first factor... » read more

Startup Funding: December 2023

By Jesse Allen - 10 Jan, 2024 - Comments: 0

Photonics and optics were strong in December, with investors funding two different companies using photonic technologies to develop AI chips and interconnects. Another key area — metaoptics — combines what traditionally would be separate lenses and optical components into a single, flat nanopatterned device. Metaoptics are being deployed in applications ranging from AI processing and sensor... » read more

Startup Funding: September 2023

By Jesse Allen - 09 Oct, 2023 - Comments: 0

Chip-to-chip and data center I/O drew investor interest in September, including support for several startups developing Compute Express Link (CXL) solutions. Elsewhere in the data center, several large rounds went to companies developing AI accelerators. And at the edge, startups are building unique ways to handle AI at very little power by initially processing data directly at the sensor. O... » read more

Startup Funding: March 2023

By Jesse Allen - 05 Apr, 2023 - Comments: 0

Funding was broadly spread between sectors in March, with automotive edging ahead thanks to a more than $100 million round for a company manufacturing electric, autonomous heavy commercial trucks for freight logistics. To keep up with the amount of information presented by cars and ADAS, several companies raised funds for head-up displays with increasing levels of detail and expanded fields of ... » read more

Knowledge Centers
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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

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Megafabs churning out the most advanced processors are not the only game in town.

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tag: QDNL Participations

Startup Funding: January 2024

Startup Funding: December 2023

Startup Funding: September 2023

Startup Funding: March 2023

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