The Week in Review: IoT

By Jeff Dorsch - 22 Jun, 2018 - Comments: 0

Finance Marvell Technology Group priced $500 million in senior notes due in 2023 and $500 million in senior notes due in 2028. The chip company will use net proceeds from the debt offering, cash on hand, and borrowings under a new term loan facility to fund the cash consideration and other amounts payable for Marvell’s proposed $6 billion acquisition of Cavium. The companies have expected to... » read more

The Week In Review: IoT

By Jeff Dorsch - 02 Jun, 2017 - Comments: 0

Analysis The Internet of Trains? That’s how Siemens sees its work in railroads, utilizing Big Data analytics and Internet of Things technology. “Sensors on an Internet of Trains system monitor everything from engine temperature, to the open or closed state of doors, to vibrations on the rails, and even image data from outside of the trains using cameras,” Bernard Marr writes in this anal... » read more

The Week In Review: IoT

By Jeff Dorsch - 19 May, 2017 - Comments: 0

Conferences It’s been an action-packed week at Internet of Things World. The show was co-located at the Santa Clara Convention Center with the Connected & Autonomous Vehicles conference. There were lots of deals announced and many products or services debuted at IoT World, which has grown enormously in four years, from 700 attendees at its first event in Palo Alto, Calif., in 2014 to some 14... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Rogue Venture Partners

The Week in Review: IoT

The Week In Review: IoT

The Week In Review: IoT