Chip Industry Week In Review

By The SE Staff - 21 Feb, 2025 - Comments: 0

The EU Commission approved €920 million in German State aid to support Infineon in setting up its Smart Power Fab in Dresden. Total funding for the Dresden site amounts to about €1 billion. PDF Solutions will acquire secureWISE for $130 million to expand the reach of its semiconductor manufacturing data platform, providing secure, remote access monitoring and control. Tariffs, trade, and ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

Testing For Thermal Issues Becomes More Difficult

Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.

by Gregory Haley

Impact of Extremely Low Temperatures On The 5nm SRAM Array Size and Performance

by Technical Paper Link

Auto Chip Aging Accelerates In Hot Climates

New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.

by Ed Sperling

Is In-Memory Compute Still Alive?

It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.

by Bryon Moyer

Hybrid Bonding Makes Strides Toward Manufacturability

Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.

by Laura Peters

Baby Steps Toward 3D DRAM

Stacking layers means a complete architecture rethink.

by Bryon Moyer

tag: Samsung SEMI

Chip Industry Week In Review

Trending Articles

Optimization of Oxygen Plasma Conditions for Cu-Cu Bonding

Chip Architectures Becoming Much More Complex With Chiplets

DeepSeek: Improving Language Model Reasoning Capabilities Using Pure Reinforcement Learning

Chiplets Still A Challenge With UCIe 2.0