Week in Review: IoT, Security, Auto

By Jeff Dorsch - 15 Feb, 2019 - Comments: 0

Internet of Things Is Google developing a Pixel Watch wearable? Perhaps, if recent job listings are any indication. The company recently was looking to hire someone as vice president of hardware engineering, wearables. Last month, Fossil Group sold smartwatch technology intellectual property to Google for $40 million, while Google hired certain members of Fossil’s wearables R&D team. ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 01 Feb, 2019 - Comments: 0

Internet of Things Pepper IoT collaborated with the Dark Cubed cybersecurity firm to produce “The State of IoT Security Report,” which can be downloaded here. Pepper IoT is an Internet of Things platform and service provider. Key findings of the report: Device security is important, but the platform is much more critical; patching will not fix systemic problems; and the market must make se... » read more

The Week in Review: IoT

By Jeff Dorsch - 27 Apr, 2018 - Comments: 0

Cybersecurity Cybersecurity concerns continued to generate news this week. Symantec reported a corporate espionage hacking campaign against manufacturers of medical supplies, dubbing the efforts “Orangeworm.” The hackers have attacked 24 or more targets this year, and almost 100 since 2015, according to the security software and services firm. Meanwhile, the House Energy and Commerce Co... » read more

Knowledge Centers
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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Secureworks

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

The Week in Review: IoT

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