The Week in Review: IoT

By Jeff Dorsch - 20 Oct, 2017 - Comments: 0

Acquisitions ASSA ABLOY has agreed to acquire August Home, a startup providing home security products; the purchase price wasn’t revealed. August Home, which raised $75 million in private funding, should fit well with the Scandinavian conglomerate’s Yale lock business. The transaction is subject to regulatory approval and customary closing conditions; it is expected to close by the end of ... » read more

The Week in Review: IoT

By Jeff Dorsch - 24 Jun, 2016 - Comments: 0

Deals Samsung said Tuesday that it will invest about $1.2 billion in Internet of Things startups in the U.S. over the next four years. Investments will be made through the Samsung Global Innovation Center in Silicon Valley and through other Samsung units. Samsung is partnering with Intel to establish the National IoT Strategy Initiative, which will take in academic and industry members and wil... » read more

The Week In Review: IoT

By Jeff Dorsch - 17 Jun, 2016 - Comments: 0

M&A Samsung Electronics will buy Joyent, a provider of public and private cloud services. The Korean company said the purchase will give Samsung a cloud platform for the Internet of Things, mobile devices, and cloud-based software and services. “Samsung brings us the scale we need to grow our cloud and software business, an anchor tenant for our industry leading Triton container-as-a-ser... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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The Week in Review: IoT

The Week in Review: IoT

The Week In Review: IoT