tag: SIP Global Partners

Startup Funding: Q1 2025

By Jesse Allen - 02 Apr, 2025 - Comments: 0

The first quarter of 2025 saw six companies raise at least $100 million in investment. Of those, three went to quantum hardware companies, with major investment into neutral atom, superconducting, and hybrid quantum control approaches. AI chips and enabling technology were another big winner in the quarter, with companies developing optical communications tech for chips and data center infra... » read more

Startup Funding: November 2021

By Jesse Allen - 01 Dec, 2021 - Comments: 0

There's nothing virtual about the level of interest in AR/VR startups. As the concept of the 'metaverse' becomes more widespread with Nvidia's recent GTC announcements and Facebook's rebranding, investors poured money into startups with enabling technology for augmented, virtual, and extended reality. Most of those are developing waveguides and other display technology that is light enough to b... » read more

Startup Funding: May 2021

By Jesse Allen - 02 Jun, 2021 - Comments: 0

Big investment poured into AI hardware companies this month, with a focus on edge applications. Companies are experimenting with different architectures, including analog-focused devices and those that are capable of withstanding the harsh conditions of space. IP and EDA startups in China also drew funding as the country tries to create a full chip design ecosystem. Plus, PCB assembly, photonic... » read more

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What Exactly Are Chiplets And Heterogeneous Integration?

New technologies drive new terminology, but the early days for those new approaches can be very confusing.

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 startups raise $2 billion.

Chip Industry Week In Review

Agentic AI chip design; $6.5B AI acquisition; IC energy consumption and emissions; US allies export controls; CPO switches; foundry and IC design house revenue reports; side-channel analysis library; 12-layer HBM4; 3D GAA utilizing 2D semis; EV charging in 5 minutes.

by The SE Staff

Big Changes Ahead For Interposers And Substrates

New materials and processes will help with power distribution and thermal dissipation in advanced packages.

by Gregory Haley

Chip Industry Week In Review

Tariff questions, impact; global sales report; Europe's chiplets focus; DARPA's quantum push; Intel 18A enters risk production; optical networking bonanza; new wafer probe test; inference benchmark results; UMC opens 22nm fab in Singapore.

by The SE Staff

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