July’19 Startup Funding

By Jeff Dorsch - 07 Aug, 2019 - Comments: 0

During the month of July, 21 technology startups took in mega-rounds of $100 million or more. Those companies together received more than $7.5 billion. On the other end of the financing spectrum, dozens of startups got seed funding or a Series A round. The dollar amounts were much smaller. Still, they are the beating heart of entrepreneurship around the world. It also was a month when som... » read more

June’19 Startup Funding

By Jeff Dorsch - 11 Jul, 2019 - Comments: 0

During the month of June, there were 15 startups that brought in funding rounds of $100 million or more, as investors continued to chase deals in cybersecurity, automotive technology, semiconductors, and a variety of services. There were no billion-dollar deals as spring slid into summer; yet, those 15 companies together raised a total of about $3.13 billion. Aurora Innovation, the developer... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 24 Aug, 2018 - Comments: 0

Internet of Things Arm uncorked its first forward-looking CPU roadmap and performance numbers for client computing. The company said it expects to deliver annual performance improvements of more than 15% per year through 2020. The targeted market includes 5G, always-on, always-connected devices. C3 IoT will work with Google Cloud to support artificial intelligence and Internet of Things dep... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: The Westly Group

July’19 Startup Funding

June’19 Startup Funding

Week in Review: IoT, Security, Auto

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