Startup Funding: April 2023

By Jesse Allen - 03 May, 2023 - Comments: 0

Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

Startup Funding: February 2023

By Jesse Allen - 08 Mar, 2023 - Comments: 0

The cost of borrowing is going up, but investors continued to pour money into the chip industry in February. Collectively, 132 companies raised more than $4.5 billion last month. One of the big beneficiaries was quantum computing, with nine companies drawing a total of more than $500 million. The bulk of that went to a quantum software and services company spun out of Alphabet, but plenty wa... » read more

Startup Funding: January 2023

By Jesse Allen - 01 Feb, 2023 - Comments: 0

Quantum computing had a good month in January, collectively raising over $240 million. A significant chunk of that went to a full-stack quantum company whose processers use neutral atoms manipulated by optical tweezers. Other companies funded this month are developing trapped ion processors, photonics-based processors, and quantum memories, which will be essential for quantum networking. Two co... » read more

Startup Funding: December 2022

By Jesse Allen - 04 Jan, 2023 - Comments: 0

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch monocrystalline silicon polished wafers and epitaxial wafers in China. The company is aiming for a production rate of 1 million pieces a month when current expansion is completed. Also in the half-billion club last month is a company making auton... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Tsinghua Research Capital

Startup Funding: April 2023

Startup Funding: February 2023

Startup Funding: January 2023

Startup Funding: December 2022