Chip Industry Week In Review

By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

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Mechanical stresses increase with larger sizes and heterogeneous materials.

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The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

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Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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