Shift Left Is The Tip Of The Iceberg
A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.
Partitioning In The Chiplet Era
Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.
NAND Flash Targets 1,000 Layers
New techniques go beyond improved deposition and etching, but challenges stack up, too.
What Comes After HBM For Chiplets
The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?
Testing For Thermal Issues Becomes More Difficult
Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.
Auto Chip Aging Accelerates In Hot Climates
New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.
How Die Dimensions Challenge Assembly Processes
Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing tools.
Is In-Memory Compute Still Alive?
It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.
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