July 2011 - Page 4 of 5 - Semiconductor Engineering

A Solution to the 450mm Equipment Problem?
By Joanne Itow - 19 Jul, 2011 - Comments: 0

By Joanne Itow Another SEMICON West has come and gone. This was a good year. Although there are signs that things have slowed a bit, the general outlook was positive. In addition to the need for more semiconductor capacity due to continued growth in tablets, cell phones and a host of other electronic applications, the increased complexity of advanced processes has created a positive outlook... » read more

Going With The Flow
By Ed Sperling - 15 Jul, 2011 - Comments: 0

It’s hard to judge things in isolation, but a continuum of acquisitions in the low-power area is proving just how important power considerations have become to hardware and software design, verification and manufacturing flows. Over the past couple of years acquisitions by Synopsys in the virtual prototyping arena, and Mentor Graphics in the test and embedded software area, have included p... » read more

IC Packaging Innovation Increasingly Replacing Moore’s Law in Mobile Electronics Competition
By Tom Morrow - 13 Jul, 2011 - Comments: 0

By Tom Morrow Smart phones, tablets, e-readers and other mobile applications are increasingly replacing PCs as the key drivers of the semiconductor industry. Consequently, IC packaging innovations that deliver high performance applications in a low-profile, low-cost, and low power design are competing with next node processing technologies as the critical platform for competition in the mobi... » read more

New Wii U™ on SOI
By Various Writers - 08 Jul, 2011 - Comments: 0

By Adele Hars If you've followed the industry buzz in recent weeks, you've seen the news: the CPU for Nintendo's upcoming (and very cool) Wii U is on IBM's 45nm SOI. IBM's been fabbing chips for Nintendo for over a decade, and first moved the company's CPUs to SOI in 2006, at 90nm. The Wii U, which got its debut at the recent E3 show, will hit the shelves in 2012. The Wii U combines m... » read more

Experts At The Table: Are We Cool?
By Ed Sperling - 08 Jul, 2011 - Comments: 0

By Ed Sperling Low-Power Engineering sat to discuss progress in the realm of power management with Ambrose Low, director of IC Design Engineering for Broadcom’s mobile platforms group; Ruggero Castagnetti, distinguished engineer at LSI, and Andy Brotman, vice president of design infrastructure at GlobalFoundries. What follows are excerpts of that conversation. LPE: Has there been any pr... » read more

The Challenge of 3D
By Ed Sperling - 06 Jul, 2011 - Comments: 0

Juan Rey, senior director of engineering for Mentor Graphics' Design To Silicon Division, talks about 3D stacking and 3D structures on chips. [youtube vid=YiH5IkxiEHU] » read more

State Of The Semiconductor industry
By Ed Sperling - 06 Jul, 2011 - Comments: 0

Jonathan Davis, executive vice president of SEMI, drills down into the state of the chip industry, what's driving the changes and what the big issues are for manufacturing and design in the future. [youtube vid=pjp5i3N1Cw4] » read more

Going Solar
By Ed Sperling - 06 Jul, 2011 - Comments: 0

Bettina Weiss, who heads SEMI’s solar effort, talks about what’s new at Semicon and Intersolar North America, how far the industry has progressed and what stands in the way of widespread adoption of solar technology. [youtube vid=rCAeaXijQy0] » read more

2.5D Stacking And Test
By Ed Sperling - 06 Jul, 2011 - Comments: 0

Michael Buehler-Garcia, director of Calibre Design Solutions marketing at Mentor Graphics, talks about the challenges in building 2.5D stacks and how testing them will become a major headache. [youtube vid=tLKdOo5L8C8] » read more

A Smart Filling Solution Yields Multiple Benefits
By Mentor Graphics Staff Writers - 01 Jul, 2011 - Comments: 0

By Jeff Wilson, A return on investment doesn’t happen until customers actually buy your product, so the most fundamental goal for designers is getting their designs to market. While there are numerous steps along the way, one task that must be performed is adding fill to the design. Fill is like design rule checking (DRC)—it’s not an optional step, because it is needed to ensure the manu... » read more

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