January 2017 - Page 4 of 11 - Semiconductor Engineering

Integrating Process Models With TCAD Simulation…
By Jacky Huang - 23 Jan, 2017 - Comments: 2

Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, and their effect on a novel device, prior to physical fabrication. Process modeling is a technique that can predict the 3D structure of a device using an understanding of unit process steps. Durin... » read more

What’s Next For Transistors
By Mark LaPedus - 23 Jan, 2017 - Comments: 1

The IC industry is moving in several different directions at once. The largest chipmakers continue to march down process nodes with chip scaling, while others are moving towards various advanced packaging schemes. On top of that, post-CMOS devices, neuromorphic chips and quantum computing are all in the works. Semiconductor Engineering sat down to discuss these technologies with Marie Semeri... » read more

Power Management Vs. State Machines
By Rich Wawrzyniak - 23 Jan, 2017 - Comments: 0

In the last several years, contemporary SoCs (systems-on-a-chip) have become very complex silicon solutions. They now consist of hundreds of millions of gates, 100 or more discrete Semiconductor Intellectual Property (SIP) blocks, high-speed data channels, megabytes of volatile and non-volatile embedded memory, increasing amounts of analog/mixed signal functionality, multiple CPU cores and mult... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Jan, 2017 - Comments: 0

Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

The Week In Review: IoT
By Jeff Dorsch - 20 Jan, 2017 - Comments: 0

Products Intel on Monday unveiled the Responsive Retail Platform, with CEO Brian Krzanich making a presentation at the National Retail Federation’s Big Show conference. “Intel’s Internet of Things (IoT) and cloud technologies touch every link of the retail supply chain. IoT sensors capture data that can be analyzed. Data centers crunch the information and give it real-world usefulness,�... » read more

The Week In Review: Design
By Jesse Allen - 20 Jan, 2017 - Comments: 0

Legal Back in 2013, Synopsys filed suit against ATopTech for copyright infringement. The courts found in favor of Synopsys and ATopTech was damages were set at a little over $30M. With appeals unsuccessful, ATopTech announced that it has filed a voluntary petition under Chapter 11 of the Bankruptcy Code and has filed a motion to sell its businesses using a stalking horse bidder (an initial b... » read more

Will EUV Kill Multi-Patterning?
By David Abercrombie - 19 Jan, 2017 - Comments: 0

When I first began working on double-patterning (DP) tools back in late 2010, there was already talk that it might be a fruitless, or at a minimum, very short-lived project, as extreme ultraviolet (EUV) lithography was just around the corner and would make all multi-patterning (MP) obsolete. Well, as I begin my seventh year on this project, I can hear echoes of Mark Twain as clearly, the report... » read more

Putting The Brakes On Consolidation
By Ed Sperling - 19 Jan, 2017 - Comments: 0

China's efforts to reduce its trade deficit by acquiring technology outside of its borders—particularly in the areas of process technology and memory—are hitting some snags. Any proposed acquisitions are being closely monitored by government agencies around the globe, and in many cases they have been quietly derailed. The Committee on Foreign Investment in the United States (CFIUS) is pa... » read more

5 Takeaways From ISS
By Mark LaPedus - 19 Jan, 2017 - Comments: 1

At the recent Industry Strategy Symposium (ISS) in Half Moon Bay, Calif., there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs and equipment. It also discussed the latest business and technology trends. In no particular order, here are my five takeaways from ISS: Bullish outlook Citing an inventory corre... » read more

Transferring Skills Getting Harder
By Ed Sperling - 19 Jan, 2017 - Comments: 0

Rising complexity in developing chips at advanced nodes, and an almost perpetual barrage of new engineering challenges at each new node, are making it more difficult for everyone involved to maintain consistent skill levels across a growing number of interrelated technologies. The result is that engineers are being forced to specialize, but when they work with other engineers with different ... » read more

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