A new technical paper titled “Semiconductor-free, monolithically 3D-printed logic gates and resettable fuses” was published by researchers at MIT.
“This work reports the first active electronics fully 3D-printed via material extrusion, i.e. one of the most accessible and versatile additive manufacturing processes. The technology is proof-of-concept demonstrated through the implementation of the first fully 3D-printed, semiconductor-free, solid-state logic gates, and the first fully 3D-printed resettable fuses,” states the paper.
Find the technical paper here and related MIT news article here.
Cañada, J., & Velásquez-García, L. F. (2024). Semiconductor-free, monolithically 3D-printed logic gates and resettable fuses. Virtual and Physical Prototyping, 19(1). https://doi.org/10.1080/17452759.2024.2404157. September 2024.
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