Author's Latest Posts


Survival Of The Cheapest?


We all want the best solution to win, but that rarely happens. History is littered with products that were superior to the alternatives and yet lost out to a lessor rival. I am sure several examples are going through your mind without me having to list them. It is normally the first to volume that wins, often accelerated by copious amounts of marketing dollar to help push it against headwinds. ... » read more

The Growing Impact Of Portable Stimulus


It has been a year since Accellera's Portable Test and Stimulus Specification became a standard. Semiconductor Engineering sat down to discuss the impact it has had, and the future direction of it, with Dave Kelf, chief marketing officer for Breker Verification Systems; Larry Melling, product management director for Cadence; Tom Fitzpatrick, strategic verification architect for Mentor, a Siemen... » read more

3D Power Delivery


Getting power into and around a chip is becoming a lot more difficult due to increasing power density, but 2.5D and 3D integration are pushing those problems to whole new levels. The problems may even be worse with new packaging approaches, such as chiplets, because they constrain how problems can be analyzed and solved. Add to that list issues around new fabrication technologies and an emph... » read more

Reducing Software Power


With the slowdown of Moore's Law, every decision made in the past must be re-examined to get more performance or lower power for a given function. So far, software has remained relatively unaffected, but it could be an untapped area for optimization and enable significant power reduction. The general consensus is that new applications such as artificial intelligence and machine learning, whe... » read more

New Technologies To Support 3D-ICs


Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

EDA Gears Up For 3D


Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

Making Security User Friendly


Serious tradeoffs between technology accessibility and other optimization factors, such as power and security, can crop up especially in the early days of a new product’s design. A new product appeals to a certain category of users who need it to perform well enough that the technology can move forward. They are willing to overlook rough edges in the product and sometimes even glory in the le... » read more

Synthesizing Hardware From Software


The ability to automatically generate optimized hardware from software was one of the primary tenets of system-level design automation that was never fully achieved. The question now is whether that will ever happen, and whether it is just a matter of having the right technology or motivation to make it possible. While high-level synthesis (HLS) did come out of this work and has proven to be... » read more

Power Modeling Standard Released


Power is becoming a more important aspect of semiconductor design, but without an industry standard for power models, adoption is likely to be slow and fragmented. That is why Si2 and the IEEE decided to do something about it. Back in 2014, the IEEE expanded its interest in power standards with the creation of two new groups IEEE P2415 - Standard for Unified Hardware Abstraction and Layer fo... » read more

Debug Tools Are Improving


Semiconductor Engineering sat down to discuss debugging complex SoCs with Randy Fish, vice president of strategic accounts and partnerships for UltraSoC; Larry Melling, product management director for Cadence; Mark Olen, senior product marketing manager for Mentor, a Siemens Business; and Dominik Strasser, vice president of engineering for OneSpin Solutions. Part one can be found here. Part two... » read more

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