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Time-of-Flight Decoding Enhanced By Tensilica Vision DSPs
By Cadence - 13 Aug, 2025 - Comments: 0

Time-of-Flight (ToF) technology has become a vital tool for precise depth perception in computer vision, driving innovation across diverse applications such as autonomous systems and medical equipment. Efficient processing of ToF data is paramount for realizing this technology’s full potential. This document highlights how Cadence's Tensilica Vision DSP architecture is significantly adv... » read more

Streamlining Functional Verification For Multi-Die And Chiplet Designs
By Cadence - 30 Jul, 2025 - Comments: 0

An Opportunity and a Challenge The manufacturing aspects of multi-die/multi-chiplet designs are often highlighted, but what about verification? Functional correctness and performance of inter-die connections via a standard interface, such as UCIe or a custom inter-die interface, are not guaranteed to meet all system requirements. These interfaces must be verified comprehensively, ensuring co... » read more

Cache-Coherent Symmetric Multiprocessing With LX8 Controllers On HiFi DSPs
By Cadence - 09 Jul, 2025 - Comments: 0

Overview This document motivates the need for a cache-coherent multicore, symmetric multiprocessor (SMP) with applications to embedded control and audio processing. It describes the current state of the art in the employment of multiple embedded processors and audio DSPs in an SoC, with a discussion of related problems that current designs face. This is followed by an introdu... » read more

3D Packaging vs 3D Integration eBook
By Cadence - 25 Jun, 2025 - Comments: 0

In this eBook, you will: •    Explore the background and trends of multi-die packages •    Learn about the distinct approaches of 3D packaging and 3D integration •    Examine the challenges within heterogeneous integration Read more here. » read more

Designing For Reliability With A System Life Estimator
By Cadence - 11 Jun, 2025 - Comments: 0

From big machines to small handheld equipment, all typically come with varying warranty timelines based on estimations. If this number is overestimated or underestimated, it can incur millions of dollars in losses to manufacturers. That’s why it’s important to look at the lifetime system estimation as a bottom-up process. The efficiency in this approach results in a robust method to formula... » read more

A New RF Platform For Silicon MMIC And System Design
By Cadence - 04 Jun, 2025 - Comments: 0

Next generation wireless modules combine innovative and proven RFIC/MMIC designs into a single package―delivering superior performance, lower power consumption, and reduced size, weight, and cost. Advanced system engineering plays a crucial role in this progress, with a strong focus on packaging interconnect design, RF analysis, and thermal and electromagnetic (EM) awareness that enable se... » read more

Agentic AI, Multi-Block Multi-User SoC Design Platform
By Cadence - 28 May, 2025 - Comments: 0

The semiconductor industry is at an inflection point within its history. The latest technological advancements in AI, quantum computing, 5G, virtual and augmented reality, IoT, autonomous driving, and biotechnology have revolutionized the semiconductor industry. The growing demands of AI workloads and sophisticated model training are spurring highly specialized semiconductor chips with intricat... » read more

Innovus+ Synthesis And Implementation System
By Cadence - 14 May, 2025 - Comments: 0

The Innovus+ platform incorporates Innovus synthesis and Innovus implementation capabilities, all integrated into one unified environment for outstanding ease of use and power, performance, and area (PPA) results. Innovus+ Synthesis can be used standalone to generate physically aware netlists ready for handoff to other design teams, such as ASIC partners, or the implementation flow can conti... » read more

Flex PCBs Explained: From Materials to Applications Technical eBook
By Cadence - 30 Apr, 2025 - Comments: 0

This ebook provides a comprehensive overview of flex PCBs, highlighting their unique benefits, materials used, common challenges, and how you can overcome them. Learn about the various applications of rigid-flex/flex PCBs in modern electronics and gain insights into the future of flex design. Read more here. Fig.1: Small Flex PCB.  Source: Cadence. » read more

Accelerating SI/PI Signoff: A Shift-Left Approach to PCB Design
By Cadence - 23 Apr, 2025 - Comments: 0

In high-speed PCB design, late-stage signal integrity (SI) and power integrity (PI) issues can lead to costly redesigns and delays. This white paper explores how in-design analysis helps engineers catch and fix SI/PI challenges early, saving time, reducing risks, and ensuring first-pass success. What You’ll Learn: The Shift-Left Advantage – How early SI/PI analysis minimizes late-s... » read more

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