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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

Protecting ICs Against Specific Threats
By Ed Sperling - 18 May, 2022 - Comments: 0

Identifying potential vulnerabilities and attack vectors is a first step in addressing them. Anders Nordstrom, security application engineer at Tortuga Logic, talks with Semiconductor Engineering about the growing risk of remote hardware attacks, what to do when a chip is hacked, and where to find the most common weaknesses for chips. » read more

Bridging IC Design, Manufacturing, And In-Field Reliability
By Ed Sperling - 18 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

Transforming AI Models For Accelerator Chips
By Ed Sperling - 17 May, 2022 - Comments: 0

AI is all about speeding up the movement and processing of data. Ali Cheraghi, solution architect at Flex Logix, talks about why floating point data needs to be converted into integer point data, how that impacts power and performance, and how different approaches in quantization play into this formula. » read more

New End Markets, More Demand For Complex Chips
By Ed Sperling - 16 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss economic conditions and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front... » read more

Hidden Impacts Of Software Updates
By Ed Sperling - 10 May, 2022 - Comments: 0

Over-the-air updates can reduce obsolescence over longer chip and system lifetimes, but those updates also can impact reliability, performance, and affect how various resources such as memory and various processing elements are used. The connected world is very familiar with over-the-air (OTA) updates in smart phones and computers, where the software stack — firmware, operating systems, dr... » read more

Zero Dark Silicon
By Ed Sperling - 09 May, 2022 - Comments: 0

Planning for AI requires an understanding of how much data needs to be processed and how quickly that needs to happen. Nick Ni, senior director of data center AI and compute markets at AMD, talks with Semiconductor Engineering about data bubbles and domain-specific designs, why dark silicon is no longer as useful as in the past, and how to optimize power and performance in both the data center ... » read more

Lots Of Data, But Uncertainty About What To Do With It
By Ed Sperling - 09 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management in heterogeneous designs, where sensors produce a flood of data, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer science at Stanford University... » read more

Rambus To Buy Hardent
By Ed Sperling - 05 May, 2022 - Comments: 0

Rambus inked a deal to buy Hardent, an engineering services company, in order to accelerate Rambus' push into the CXL arena. Compute Express Link (CXL), developed primarily by Intel before being turned into an open industry standard, allows memory to be disaggregated within a data center and shared across multiple servers. This, in turn, lets data centers control how critical resources are a... » read more

Making More Reliable And More Efficient Auto ICs
By Ed Sperling - 05 May, 2022 - Comments: 0

Sam Geha, executive vice president of memory solutions at Infineon Technologies, sat down with Semiconductor Engineering to talk about automotive chips, supply chain issues, and integration challenges. What follows are excerpts of that conversation. SE: How do you build an automotive chip that will work in any environment? Geha: The automotive market is, of course, one of the most demand... » read more

CEO Outlook: Chip Industry 2022
By Ed Sperling - 02 May, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss broad industry changes and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front of a live audience... » read more

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