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Research Bits: September 11


Combining digital and analog Researchers from École Polytechnique Fédérale de Lausanne (EPFL) propose integrating 2D semiconductors with ferroelectric materials for joint digital and analog information processing, which could improve energy efficiency and support new functionality. The device uses a 2D negative-capacitance tungsten diselenide/tin diselenide tunnel FET (TFET), which consu... » read more

Blog Review: September 6


Cadence's Reela Samuel listens in as industry experts discuss whether generative AI-powered tools could facilitate the creation of diverse chip types and address talent shortages by creating  a more accessible entry point for those interested in circuit, chip, or system design. Synopsys' Ian Land, Jigesh Patel, and Kenneth Larsen find that the way that today’s government, aerospace, and d... » read more

Research Bits: September 5


Layered TMD semiconductors Scientists from Tsinghua University investigated fabrication techniques for fabricating and engineering transition metal dichalcogenides (TMDs). By modulating TMDs with various methods, including phase engineering, defect engineering, doping, and alloying, the material class could provide a wide range of alternatives for high-quality layered semiconductors with st... » read more

Blog Review: August 30


Siemens' Dan Yu examines hallucinations in large language models, the Universal Approximation Theorem, and the role they play in applying LLMs to EDA. Cadence's Mamta Rana introduces shared flow control in PCIe 6.0, which enables the reduced cost implementation of multiple virtual channels by allowing common sets of resources to be shared. Synopsys' Arturo Salz and Johannes Stahl note tha... » read more

Research Bits: August 29


Resistive switching with hafnium oxide Researchers from the University of Cambridge, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo used hafnium oxide to build a resistive switching memory device that processes data in a similar way as the synapses in the human brain. At the atomic level, hafnium oxide has no structure, with the hafni... » read more

Blog Review: Aug. 23


Siemens' Stephen Chavez discusses best practices when it comes to thermal analysis for PCB design, including component placement and close collaboration between mechanical and electrical engineering disciplines. Synopsys' Gary Ruggles, Richard Solomon, and Varun Agrawal introduce the Compute Express Link (CXL) specification and how it could help improve latency through computational offloadi... » read more

Research Bits: August 22


Photonic memory Researchers from Zhejiang University, Westlake University, and the Chinese Academy of Sciences developed a 5-bit photonic memory capable of fast volatile modulation and proposed a solution for a nonvolatile photonic network supporting rapid training. This was made possible by integrating the low-loss phase-change material (PCM) antimonite (Sb2S3) into a silicon photonic plat... » read more

Blog Review: Aug. 16


Synopsys' Johannes Stahl and Tim Kogel suggest that multi-die systems require a new approach at the architecture planning phase and why chip designers can’t ignore physical effects such as layout, power, temperature, or IR-drop. Siemens' Rich Edelman argues for using the waveform window in a GUI rather than $display when debugging UVM. Cadence's Paul Scannell stresses the need for diver... » read more

Research Bits: August 15


Using noise for spintronics Researchers from the Institute for Basic Science built a vertical magnetic tunneling junction device by sandwiching a few layers of vanadium in tungsten diselenide (V-WSe2), a magnetic material, between top and bottom graphene electrodes to create high-amplitude Random Telegraph Noise (RTN) signals. Through the resistance measurement experiments using these devic... » read more

Week In Review: Design, Low Power


U.S. President Joe Biden issued an executive order to restrict U.S. investment in Chinese companies, targeting semiconductors and microelectronics, quantum information technologies, and artificial intelligence systems with military or intelligence applications. Specific technologies within these groups will be defined later. Some will only require investors to notify the Department of the Tre... » read more

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