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Jesse Allen

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Jesse Allen is the Knowledge Center administrator and a senior editor at Semiconductor Engineering.

Author's Latest Posts

Research Bits: May 23
By Jesse Allen - 23 May, 2023 - Comments: 0

DNA-based molecular computing Researchers at the University of Minnesota proposed a new method of biocomputing. Trumpet, or Transcriptional RNA Universal Multi-Purpose GatE PlaTform, uses biological enzymes as catalysts for DNA-based molecular computing. Researchers performed logic gate operations in test tubes using DNA molecules. A positive gate connection resulted in a phosphorescent glo... » read more

Blog Review: May 17
By Jesse Allen - 17 May, 2023 - Comments: 0

Synopsys' Dana Neustadter examines the key industries driving Ethernet security, challenges to securing Ethernet networks, and the MACsec protocol that guards against network data breaches by encrypting data traffic between Ethernet-connected devices. Siemens' Stephen Chavez points to the improvements gained from design reuse in PCB design but warns that inefficient processes for managing an... » read more

Research Bits: May 16
By Jesse Allen - 16 May, 2023 - Comments: 0

Germanium-tin transistor Scientists at Forschungszentrum Jülich, CEA-Leti, University of Leeds, Leibniz Institute for High Performance Microelectronics, and RWTH Aachen University fabricated a new type of transistor from a germanium-tin alloy. Charge carriers can move faster in the material than in silicon or germanium, which enables lower voltages in operation. “The germanium–tin syst... » read more

Week In Review: Design, Low Power
By Jesse Allen - 12 May, 2023 - Comments: 1

Synopsys acquired Silicon Frontline Technology, a provider of an electrical layout verification solution for mixed-signal and analog designs, large-scale power semiconductor devices, and electrostatic discharge protection networks. "This acquisition enables Synopsys to extend the capabilities of our design analysis portfolio and help build out a system-level electrical analysis platform. We als... » read more

Blog Review: May 10
By Jesse Allen - 10 May, 2023 - Comments: 0

Synopsys' Alessandra Nardi and Uyen Tran explain how to meet quality, reliability, functional safety, and security requirements of automotive chips through thorough test programs, path-margin monitoring, and design failure mode and effect analysis (DFMEA). Cadence's Veena Parthan explores how computational fluid dynamics can help predict and model the generation, propagation, and mitigation ... » read more

Research Bits: May 10
By Jesse Allen - 10 May, 2023 - Comments: 0

Growing 2D TMDs on chips Researchers from Massachusetts Institute of Technology (MIT), Oak Ridge National Laboratory, and Ericsson Research found a way to “grow” layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a fully fabricated silicon chip, a technique they say could enable denser integrations. The researchers focused on molybdenum disulfide, which is f... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 May, 2023 - Comments: 0

Arm advanced its progress toward an initial public offering, confidentially submitting a draft registration statement on Form F-1 to the U.S. Securities and Exchange Commission. The size and price range for the proposed offering have yet to be determined. Graphene IDM Paragraf acquired Cardea Bio, a maker of graphene-based biocompatible chips. Cardea has developed a biosignal processing unit... » read more

Blog Review: May 3
By Jesse Allen - 03 May, 2023 - Comments: 0

Synopsys' Thomas Andersen considers the requirements of AI-optimized chips that are resulting in exploration of different memory configurations, different types of memory, and different types of processor technologies and software components. Cadence's Girish Vaidyanathan considers the role of hierarchy and partitioning in custom design and looks at how a virtual hierarchy allows layout desi... » read more

Startup Funding: April 2023
By Jesse Allen - 03 May, 2023 - Comments: 0

Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

Research Bits: May 2
By Jesse Allen - 02 May, 2023 - Comments: 0

Reconfigurable FeHEMT Researchers at the University of Michigan created a reconfigurable ferroelectric transistor that could enable a single amplifier to do the work of multiple conventional amplifiers. “By realizing this new type of transistor, it opens up the possibility for integrating multifunctional devices, such as reconfigurable transistors, filters and resonators, on the same plat... » read more

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