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Jesse Allen

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Jesse Allen is the Knowledge Center administrator and a senior editor at Semiconductor Engineering.

Author's Latest Posts

Power/Performance Bits: Oct. 11
By Jesse Allen - 11 Oct, 2021 - Comments: 0

Finer printed circuits Researchers from the National Institute for Materials Science in Japan, Jiangnan University, Zhengzhou University, Senju Metal Industry Co., and C-INK Co. developed a way to print smaller features for printed electronics. The directed self-assembly method increases the chemical polarity of predetermined areas on a surface, which promoted selective adhesion of metallic na... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Oct, 2021 - Comments: 0

Arteris IP plans to become a public company. It filed a registration statement with the SEC for an IPO, and intends to list on Nasdaq. The number of shares to be offered and the price range for the proposed offering have not yet been determined. Arteris IP provides network-on-chip interconnect IP, cache coherent interconnects, and packages to speed functional safety certification alongside IP d... » read more

Blog Review: Oct. 6
By Jesse Allen - 06 Oct, 2021 - Comments: 0

Arizona State University's Jae-sun Seo and Arm's Paul Whatmough introduce a fully-parallel and fully-pipelined FPGA accelerator for sparse CNNs that can eliminate off-chip memory access and also efficiently support elementwise pruning of CNN weights. Cadence's Paul McLellan highlights trends seen at the recent Hot Chips, from machine learning and advanced packaging driving higher performance... » read more

Power/Performance Bits: Oct. 5
By Jesse Allen - 05 Oct, 2021 - Comments: 0

Modeling resistive-switching memory Researchers from Singapore University of Technology and Design (SUTD) and Chang Gung University developed a new toolkit for modeling current in resistive-switching memory devices. The team said that traditional physical-based models need to consider complex behaviors to model current in resistive memory, and there's a risk of permanent device damage due t... » read more

Startup Funding: September 2021
By Jesse Allen - 04 Oct, 2021 - Comments: 0

Startups focused on data center chips had a big month in September. A new emergent from stealth promises to accelerate big data analytics, and startups proving CXL connectivity and high-performance RISC-V chiplets also drew funding. On the other end of the spectrum, NB-IoT and edge AI designers saw investment while a company providing on-chip monitoring can predict when chips will fail. Plus, c... » read more

Week In Review: Design, Low Power
By Jesse Allen - 01 Oct, 2021 - Comments: 0

Valens Semiconductor began trading on the New York Stock Exchange as VLN after a merger with special-purpose acquisition company (SPAC) PTK Acquisition Corp. Valens offers high-speed connectivity chips for the audio-video and automotive markets, including its HDBaseT technology for connectivity between ultra-HD video sources and remote displays and its in-vehicle high-speed links. The transacti... » read more

Blog Review: Sept. 29
By Jesse Allen - 29 Sep, 2021 - Comments: 0

Cadence's Paul McLellan checks out two of the biggest chips presented at the recent Hot Chips: a graphics chip from Intel for an upcoming supercomputer and Cerebras' wafer-scale AI chip. Synopsys' Datsen Davies Tharakan lists the top five design challenges for electric vehicles and power semiconductors and why a robust design flow can accelerate the growth of hybrid and electric vehicles goi... » read more

Power/Performance Bits: Sept. 28
By Jesse Allen - 28 Sep, 2021 - Comments: 0

Pneumatic memory Engineers at the University of California Riverside developed a pneumatic memory that can be used to control soft robots. Pneumatic soft robots use pressurized air to move soft, rubbery limbs and grippers, making them ideal for delicate tasks as well as safer to be around. However, they still require electronic valves and computers to control and maintain positions. The ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 24 Sep, 2021 - Comments: 0

U.S. government officials met with semiconductor industry companies and automakers to request supply chain information it hopes could address the current semiconductor shortage, Reuters reports. Secretary of Commerce Gina Raimondo hopes the information will enable them and industry to "get more granular into the bottlenecks and then ultimately predict challenges before they happen," but also wa... » read more

Blog Review: Sept. 22
By Jesse Allen - 22 Sep, 2021 - Comments: 0

Ansys' Tyler Ferris describes some of the many ways electronics on a PCB assembly can fail, from component level failures like wirebond breaking and liftoff to board-level failures such as conductive anodic filament failure. Cadence's Paul McLellan considers the switch from low-speed parallel interfaces to high-speed serial interfaces as one of the key advancements making modern data centers... » read more

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