Mark LaPedus

  (all posts)
Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Dec, 2020 - Comments: 0

Packaging and EMS ASE is expanding its efforts in the electronic manufacturing services (EMS) business. Universal Scientific Industrial (USI), a subsidiary of ASE, has completed the acquisition of Asteelflash Group through the acquisition of its parent company, Financière. USI provides electronic design and manufacturing services. It also provides system-in-package (SiP) modules. Asteelfla... » read more

Manufacturing Bits: Dec. 1
By Mark LaPedus - 01 Dec, 2020 - Comments: 0

New phase-change materials The National Institute of Standards and Technology (NIST) has developed an open source machine learning algorithm for use in discovering and developing new materials. NIST’s technology, called CAMEO, has already been used by researchers to discover a new phase-change memory material. CAMEO, which stands for Closed-Loop Autonomous System for Materials Exploration... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Nov, 2020 - Comments: 0

Market research VLSI Research has raised its forecast for semiconductors and fab equipment in 2020. In its previous forecast, VLSI Research projected that the equipment market would reach $84.8 billion in 2020, up 10.1% over 2019. Now, in its latest forecast (See page 2), the equipment market is projected to hit $89.8 billion in 2020, up 16.6%. “The equipment business is booming,” said ... » read more

Manufacturing Bits: Nov. 25
By Mark LaPedus - 25 Nov, 2020 - Comments: 0

Lidar-on-a-chip At the upcoming IEEE International Electron Devices Meeting (IEDM), Samsung will present a paper on the industry’s first single-chip lidar beam scanner. (Go to this link and then look for paper 7.2, “Single-Chip Beam Scanner with Integrated Light Source for Real-Time Light Detection and Ranging,” J. Lee et al, Samsung.) Lidar, or light imaging, detection, and ranging, ... » read more

Emerging Apps And Challenges For Packaging
By Mark LaPedus - 23 Nov, 2020 - Comments: 0

Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Nov, 2020 - Comments: 0

Fab tools PDF Solutions has entered into a definitive agreement to acquire Cimetrix. Under the terms, PDF will pay a cash amount of $35.0 million, net of cash on Cimetrix’s balance sheet as of closing, and subject to other closing adjustments. With the move, PDF will expand into new markets. Cimetrix is a provider of equipment connectivity products for smart manufacturing and Industry 4.0... » read more

Upturn Seen For Silicon Wafer Market
By Mark LaPedus - 19 Nov, 2020 - Comments: 0

After a downturn in 2019, the silicon wafer market is expected to rebound in 2020. 2021 looks even better for silicon wafers. Silicon wafers are a fundamental part of the semiconductor business. Every chipmaker needs to buy them in one size or another. Silicon wafer vendors produce and sell bare or raw silicon wafers to chipmakers, who in turn process them into chips. The silicon wafer ma... » read more

EUV Challenges And Unknowns At 3nm and Below
By Mark LaPedus - 19 Nov, 2020 - Comments: 1

The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks. These will be necessary to reach future process nodes, but they are more complex and expensive than the current EUV pro... » read more

What’s Next In AI, Chips And Masks
By Mark LaPedus - 19 Nov, 2020 - Comments: 0

Aki Fujimura, chief executive of D2S, sat down with Semiconductor Engineering to talk about AI and Moore’s Law, lithography, and photomask technologies. What follows are excerpts of that conversation. SE: In the eBeam Initiative’s recent Luminary Survey, the participants had some interesting observations about the outlook for the photomask market. What were those observations? Fujimur... » read more

Manufacturing Bits: Nov. 17
By Mark LaPedus - 17 Nov, 2020 - Comments: 0

Intel’s gate-all-around FETs At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel is expected to present papers on its efforts to develop gate-all-around transistors. One paper from Intel describes a more conventional gate-all-around transistor technology called a nanosheet FET. Another paper involves a next-generation NMOS-on-PMOS nanoribbon transistor technology. (F... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy