Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Mar, 2019 - Comments: 0

Chipmakers and OEMs Cypress Semiconductor has received regulatory antitrust approval for the closing of its previously-announced joint venture with SK Hynix. The new joint venture, SkyHigh Memory, will provide single-level cell (SLC) NAND memory solutions. Cree has announced the execution of a definitive agreement to sell its Lighting Products business unit (Cree Lighting), which includes t... » read more

Finding Defects In Chips With Machine Learning
By Mark LaPedus - 12 Mar, 2019 - Comments: 7

Chipmakers are using more and different traditional tool types than ever to find killer defects in advanced chips, but they are also turning to complementary solutions like advanced forms of machine learning to help solve the problem. A subset of artificial intelligence (AI), machine learning has been used in computing and other fields for decades. In fact, early forms of machine learning ha... » read more

Manufacturing Bits: March 11
By Mark LaPedus - 11 Mar, 2019 - Comments: 0

Measuring molecules The Technical University of Munich (TUM) has developed a new metrology technique that determines the properties of individual molecules. The technique, called single-molecule excitation–emission spectroscopy, improves upon the traditional methods to explore molecules. The traditional method, dubbed single-molecule spectroscopy (SMS), is not new and is used to analyze f... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 08 Mar, 2019 - Comments: 0

Chipmakers How bad is the slowdown in the IC industry? The memory market is terrible, while other markets are slowing. One company—Renesas--is feeling the brunt. Citing the IC slowdown, Renesas will temporarily halt production at 13 of the company's 14 production facilities, according to a report from Nikkei. Renesas confirmed the move. “Renesas is considering implementing measures to ... » read more

Manufacturing Bits: March 5
By Mark LaPedus - 05 Mar, 2019 - Comments: 0

WAAM process Thales Alenia Space, Cranfield University and Glenalmond Technologies have produced a prototype of a titanium pressure vessel for use in future space missions. The vessel is 1 meter in height and weighs 8.5kg. The titanium alloy is made using Cranfield’s additive technology, dubbed the Wire + Arc Additive Manufacturing (WAAM) process. Related to 3D printing technology, WA... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Mar, 2019 - Comments: 1

Trade Trade tensions between the United States and China continue. The U.S. last year slapped a 10% tariff on $200 billion worth of Chinese goods. China retaliated with a 10% tariff on $60 billion of U.S. imports. The U.S. said it wants to increase the tariffs on Chinese goods to 25%, but that action has been postponed. This was the week that the U.S. was supposed to raise tariffs by 25%. I... » read more

Manufacturing Bits: Feb. 26
By Mark LaPedus - 26 Feb, 2019 - Comments: 0

Vitamin C chips Using vitamin C, Rice University has developed a process that turns gold nanorods into small gold nanowires. Nanorods are a type of structure, while nanowires are simply tiny wires. With the technology, Rice is able to produce nanowires with various lengths. These can be used in electronics as well as light-manipulating applications like plasmons. A “plasmon is a quantum o... » read more

Engineering Talent Shortage Now Top Risk Factor
By Mark LaPedus - 25 Feb, 2019 - Comments: 16

Demand is increasing for engineers and related technical fields in the IC industry, but companies are struggling to find enough talent. The problem is even worse in hot new markets such as AI and 5G, where competition is fierce for experienced workers. The talent shortfall starts with college graduates and professionals in the fields of science, technology, engineering and mathematics (STEM)... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Feb, 2019 - Comments: 0

Chipmakers IC Insights has released the process technology roadmaps for chipmakers and foundries. GlobalFoundries, Intel, Samsung, SMIC, TSMC and UMC are highlighted. GlobalFoundries has announced that the company’s 8SW RF SOI technology has delivered more than a $1 billion of client design win revenue since its launch in 2017. RF SOI is designed for RF switches and other devices in 4G/... » read more

5 Top Storylines For NAND Biz
By Mark LaPedus - 21 Feb, 2019 - Comments: 0

2019 is expected to be a busy, if not difficult, year in the NAND flash memory market. Vendors will continue to ramp up 3D NAND, the successor to traditional 2D or planar NAND. Then, over the last year, prices for NAND have dropped with oversupply in the market. What’s in store in 2019? Vendors are expected to rush out their next-generation products. Then, there is a debate whether the... » read more

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