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Using Emulation to Deliver Storage Market Innovations
By Mentor, a Siemens Business - 13 Sep, 2017 - Comments: 0

SSDs have the unique challenges of using NAND flash as a storage medium. As storage technology and use models continue to evolve, so do the verification tools needed to solve today’s challenges. The Veloce emulator is well suited to address these challenges as has been proven by leading storage companies who are using it today in their production environments. To read more, click here. » read more

Fusing CMOS IC And MEMS Design For IoT Edge Devices
By Mentor, a Siemens Business - 11 Sep, 2017 - Comments: 0

Creating a sensor-based IoT edge device is challenging, due to the multiple design domains involved (Analog, digital, RF, and MEMS). But, creating an edge device that combines the electronics using the traditional CMOS IC flow and a MEMS sensor on the same silicon die can seem impossible. In fact, many IoT edge devices combine multiple dies in a single package, separating electronics from the M... » read more

Being A Player In The Automotive IC Market
By Mentor, a Siemens Business - 06 Sep, 2017 - Comments: 0

The automotive IC market is loaded with opportunity and above-average growth rates. Arguably, the pursuit of this opportunity explains much of the astonishing M&A activity among the world's biggest semicos in recent years. The common denominator — whether for established auto IC vendors, big tech players edging into self-driving cars or automakers looking to design their own chips — is the ... » read more

Frontloading CFD-Required Technologies
By Mentor, a Siemens Business - 23 Aug, 2017 - Comments: 0

Today, manufacturing product design cycles need to get shorter and shorter as either new or increased numbers of products get to the market faster. In the automotive industry for example, with either facelifts to existing car models, or the next generation of the model appearing almost every 3-4 years, and an increasing number of new models appearing on the market, the demand on engineering des... » read more

Addressing The Complex Challenges In Low-Power Design And Verification
By Mentor, a Siemens Business - 09 Aug, 2017 - Comments: 0

This paper provides a comprehensive analysis of various complex debug problems faced in low-power design and verification. By using relevant examples it demonstrates how these issues can be either avoided or easily solved. We will also highlight some of the common pitfalls that low-power designers can avoid, which otherwise can lead to complex low-power issues that are difficult to debug at lat... » read more

Solving The Design And Verification Challenges Of High Density Advanced Packaging
By Mentor, a Siemens Business - 07 Aug, 2017 - Comments: 0

This paper discusses ways in which design teams can apply silicon (IC) type processes to the design and verification of the emerging HDAP packages. High Density Advanced Packaging, or HDAP, is the next-generation architecture for increased functional density, higher performance, lower power, smaller PCB footprints, and thinner profiles. This new “breed” of disruptive packaging technology... » read more

Finally, A Painless Solution For Analog Verification Management
By Mentor, a Siemens Business - 03 Aug, 2017 - Comments: 0

Usually, teams manage analog simulations manually or they use complex and expensive tools that require intricate setup and proprietary test plans before they can be deployed. What teams need is an easy way to manage analog verification in order to track the large number of simulations for each project. Tracking simulation results at all levels for each team member and project managers requires ... » read more

1D-3D CFD And 3D-1D CFD: Simulation Based Characterization
By Mentor, a Siemens Business - 26 Jul, 2017 - Comments: 0

To understand 1D-3D CFD and 3D-1D CFD, we have reviewed the history of attempts at both loose and close coupling of 1D and 3D CFD codes, the motivations of engineers who did it, and the benefits to be gained from these complementary engineering simulation technologies. Not least, because the umbrella term ‘1D/3D’ covers a number of different possible implementations with their own pros and ... » read more

Implementing High-Density-Advanced Packaging for OSATs And Foundries
By Mentor, a Siemens Business - 12 Jul, 2017 - Comments: 0

HDAP design and verification require cooperation and collaboration between design houses, OSATs, foundries, and EDA vendors. By using common tools that have the integration and functionality needed to operate in both the IC and packaging domains and by developing and deploying process optimized design-kits such as ADK’s and PDKs, OSATs, foundries, and their customers can achieve design, fabri... » read more

Get To Market Fast And First With Reusable Circuit Blocks
By Mentor, a Siemens Business - 10 Jul, 2017 - Comments: 0

Reusable circuit blocks enable design teams to build new products quickly, but how do you manage a process that spans both library and design? How do you know which elements need to be managed? This paper describes techniques for leveraging certified circuits and providing continuous circuit improvement, best practices for using reusable circuit blocks, and how these blocks can be used to track... » read more

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