What’s needed to create advanced chips for cars and to stake a claim in the automotive supply chain.
The automotive IC market is loaded with opportunity and above-average growth rates. Arguably, the pursuit of this opportunity explains much of the astonishing M&A activity among the world’s biggest semicos in recent years. The common denominator — whether for established auto IC vendors, big tech players edging into self-driving cars or automakers looking to design their own chips — is the need for EDA software to solve design, verification and test challenges. Mentor director of automotive marketing, Andrew Macleod, describes the tools that are key to creating advanced auto ICs and accordingly helping to stake out territory in the evolving auto supply chain.
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Rising costs and gaps in equipment emerge as technology scales; new tools under development.
Explosion of data is forcing significant changes in where processing is done.
Experts at the Table, part 1: Shrinking features isn’t enough anymore. The big challenge now is how to achieve economies of scale and minimize complex integration issues.
New market opportunities and global competitiveness are limited by qualified people.
Researchers digging into ways around the von Neumann bottleneck.
The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen.
Better algorithms and more data could bolster adoption, particularly at advanced nodes.
30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.
New architectures, packaging approaches gain ground as costs increase, but shrinking features continues to play a role.
Improvement still needed for uptime, defectivity, line edge roughness and process flows.
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