Author's Latest Posts

450mm Standards Update
By SEMI - 20 Mar, 2014 - Comments: 0

By Kevin Nguyen SEMI has published more than 19 Standards for 450mm generation.  New standards are being created to facilitate supplier and user for material and equipment.  Revisions to published standards are needed as improvements are constantly identified. The Japan Assembly & Packaging Technical Committee (TC) Chapter has initiated document 5636 in effort to meet the demand... » read more

Semiconductor Fab Materials Outlook
By SEMI - 16 Aug, 2013 - Comments: 0

By Dan Tracy While segments of the global economy are slowing and uncertainty is once again on the rise, fundamental unit trends for semiconductor materials have improved in recent months and growth expectations for the fab materials market remain modest for 2012 and into 2013. Three-month shipment data shows silicon shipments—from the wafer suppliers to the fabs—during the current cycl... » read more

Upbeat Prediction
By SEMI - 18 Apr, 2013 - Comments: 0

By Clark Tseng The semiconductor industry started out quite strong in 2012 but declined rapidly in the second half of the year, resulting in a slight year-over-year decline of 2.7% in worldwide semiconductor sales. On the other hand, worldwide capital equipment market recorded a decline of 15% from $43.5 billion in 2011 to $36.9 billion in 2012 according to the SEMI WWSEMS report. While indust... » read more

European Policy Considerations for Supporting the 450mm Supply Chain and Existing Manufacturing
By SEMI - 08 Mar, 2012 - Comments: 0

By Heinz Kundert, president, SEMI Europe European competitiveness in the semiconductor industry was the focus of the SEMI Industry Strategy Symposium Europe 2012 executive conference recently held in Munich, Germany. Over 200 delegates from 20 countries gathered to hear about the strengths and issues of concern for chip manufacturing in Europe, including the implications of the industry-wide... » read more

Packaging Community Takes on New Challenges through Industry Collaboration
By SEMI - 25 Jan, 2012 - Comments: 0

By Tom Salmon, senior director, SEMI As the semiconductor industry responds to increasing demands for lower power, higher performance and reduced form factor, packaging technologies are increasingly important.  This enhanced importance in the micro-electronics food chain is mirrored in a growth of the different segments of the packaging market.  According to the recently updated Global Sem... » read more

Substrates for Semiconductor Packaging
By SEMI - 16 Jan, 2012 - Comments: 0

2012 Market Outlook for Laminate and Leadframe Materials By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI Combined, laminate substrates and leadframes will represent an estimated US$ 13.3 billion market in 2011 and is forecasted to reach $14 billion in 2012. This is larger than the revenues for silicon wafers (including silicon-on-insulator wafers) of $10.3 billion in 2011 and... » read more

The End of the DRAM Era – Flash Spending Surpasses DRAM
By SEMI - 06 Oct, 2011 - Comments: 0

By Clark Tseng, SEMI Industry Research and Statistics, Taiwan The semiconductor memory industry has a long history of fluctuating market cycles. The DRAM sector in particular has gone through a few bad cycles and witnessed quite a few consolidations in the past ten years or so.  However, DRAM continues to be one of the most important and capital intensive sectors in the semiconductor indust... » read more

3D-IC, LED and 450 mm Update
By SEMI - 03 Sep, 2011 - Comments: 0

By James Amano, director, SEMI International Standards The SEMI International Standards Program brings together industry experts to exchange ideas and work towards developing globally accepted technical standards. SEMI provides a forum for the essential collaborations that must be achieved to move new and existing markets forward efficiently and profitably. Here are the latest updates on... » read more

A Report from the 5th SEMI Brussels Forum
By SEMI - 17 Jun, 2011 - Comments: 0

By Heinz Kundert First, I’d like to give you some background on the SEMI Brussels Forum. It is our industry’s annual advocacy-focused event attended by industry executives and stakeholders of the European Union. Currently, our forum is the leading policy event for the European semiconductor and photovoltaic (PV) equipment and materials industries. A couple weeks ago, the 5th SEMI Bru... » read more

Japan Earthquake: The Industry Will Respond and Rebound
By SEMI - 11 Apr, 2011 - Comments: 0

By Stanley T. Myers, president and CEO, SEMI The massive earthquake, tsunami and power plant disaster in Japan has brought great sadness to the semiconductor industry, as it has to people all over the world. Japan is a pioneer and leader in the global chip industry whose contributions are valued the world over. SEMI and our member companies extend our deepest condolences to our friends and c... » read more

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