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3D-IC, LED and 450 mm Update

By SEMI - 03 Sep, 2011 - Comments: 0

By James Amano, director, SEMI International Standards The SEMI International Standards Program brings together industry experts to exchange ideas and work towards developing globally accepted technical standards. SEMI provides a forum for the essential collaborations that must be achieved to move new and existing markets forward efficiently and profitably. Here are the latest updates on... » read more

A Report from the 5th SEMI Brussels Forum

By SEMI - 17 Jun, 2011 - Comments: 0

By Heinz Kundert First, I’d like to give you some background on the SEMI Brussels Forum. It is our industry’s annual advocacy-focused event attended by industry executives and stakeholders of the European Union. Currently, our forum is the leading policy event for the European semiconductor and photovoltaic (PV) equipment and materials industries. A couple weeks ago, the 5th SEMI Bru... » read more

Japan Earthquake: The Industry Will Respond and Rebound

By SEMI - 11 Apr, 2011 - Comments: 0

By Stanley T. Myers, president and CEO, SEMI The massive earthquake, tsunami and power plant disaster in Japan has brought great sadness to the semiconductor industry, as it has to people all over the world. Japan is a pioneer and leader in the global chip industry whose contributions are valued the world over. SEMI and our member companies extend our deepest condolences to our friends and c... » read more

Innovation Is Not Enough

By SEMI - 14 Mar, 2011 - Comments: 0

By Heinz Kundert, president, SEMI Europe We often hear that innovation is the key to smart and sustainable growth for Europe. But history has shown that innovation alone is not enough to create sustainable growth and sufficient jobs. To achieve an acceptable return on investment in Europe, advanced manufacturing is indispensible. Therefore, it is good to see that the European Commission has ... » read more

3D-IC Standards Key to TSV Adoption

By SEMI - 22 Feb, 2011 - Comments: 0

By James Amano, director, SEMI International Standards Three-Dimensional Stacked Integrated Circuits (3D-ICs) are composed of a stack of two-dimensional die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current integration methods like wirebond and flip chip have been in production for some time, but the next generation of 3D integration inco... » read more

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