450mm Standards Update

More than 19 standards have been published for 450mm wafer manufacturing.


By Kevin Nguyen

SEMI has published more than 19 Standards for 450mm generation.  New standards are being created to facilitate supplier and user for material and equipment.  Revisions to published standards are needed as improvements are constantly identified.

The Japan Assembly & Packaging Technical Committee (TC) Chapter has initiated document 5636 in effort to meet the demand of Automated Material Handling System (AMHS) manufacturers by adding detection area in Tape Frame Release Bar (TFRB) by revising SEMI G92-1113  Specification for Tape Frame Cassette for 450mm Wafer.  The document was issued for ballot in cycle 1 of 2014 and is expected to approve by the Japan Packaging TC Chapter in March 20, 2014 meeting.

The 450mm Int’l Physical Interface Carriers & Int’l Process Module Physical Interface Joint Task Forces also proposed revisions (doc. 5626) to both

The intent is to improve Equipment Front End Module (EFEM) pocket volume allowing conventional robot to have extra range of vertical motion.  Similarly, this document was balloted in cycle 1 of 2014 and will be adjudicated by the Japan Physical Interfaces & Carriers TC Chapter inApril 14, 2014 meeting.

SEMI has 300mm wafer shipping system standard (M45).  However, a specification for 450 mm generation system has not been standardized.  The Int’l 450mm Shipping Box Task Force is attempting its second try to gain consensus for doc. 5069A, Specification for 450 mm Wafer Shipping System.  The ballot is being issued for voting in cycle 2, 2014.  All interested voters will have until March 17, 2014 to submit feedback. When voting is closed, it will be reviewed by the North America Physical Interfaces & Carriers TC Chapter on the April 2, 2014 meeting at Intel in Santa Clara, California.

The Int’l Advanced Wafer Geometry Task Force has issued ballot 5654, issued in cycle 2, revision to SEMI M49-0613, Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 16 nm Technology Generations.  The goal is to reduce 450 mm wafer edge exclusion from 2 mm to 1.5 mm for 16 nm technology generation. This ballot will be adjudicated at the North America Silicon Wafer TC Chapter meeting in July 8, 2014 during SEMICON West in San Francisco, California.

In addition, ongoing discussions are taking place between the int’l Polished Wafer and int’l 450 mm Wafer Task Forces to add 450mm notchless wafer specification (doc. 5604) and increase the Fixed Quality Area (FQA) for 450mm wafer from 223 mm to 223.5 mm for yield purpose (doc. 5655).  Both revisions will be incorporated in SEMI M1-0114 – Specification for Polished Single Crystal Silicon Wafers.  These changes are significant since there may be limitations in verifying the quality of wafers close to the wafer edge due to limitations of measurement equipment.  These ballots are anticipated to be issued in cycle 3 or 4 in April through June, 2014 for review at SEMICON West 2014.

If your company is not yet involved in these efforts to shape the future, learn more about SEMI Standards by visiting www.semi.org/en/Standards. Note that participation in the SEMI Standards Program is free, but requires registration. To learn more, contact your local SEMI Standards staff or register at: www.semi.org/standardsmembership.  For additional 450 information (PPTs, viewpoints, etc.), visit 450 Central at www.semi.org/450.

—Kevin Nguyen is the HQ standards manager at SEMI

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