Author's Latest Posts

Comparing Formal And Simulation Code Coverage

By Siemens EDA - 09 Mar, 2022 - Comments: 0

There is a difference in semantics between code coverage generated from a simulator engine and code coverage generated from a formal engine. This paper seeks to raise the awareness of verification engineers on how best to make use of the code coverage data generated by different verification engines. The paper lays out the reasons for using code coverage and describes how simulation code covera... » read more

Navigating The Intersection Of Safety And Security

By Siemens EDA - 09 Mar, 2022 - Comments: 0

Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. In the past, electronics going into vehicle systems implemented flat architectures with isolated functions controlling various components of the power train and vehicle dynamics. However, to support the realization of Level 4 and Level 5 (L4/L5) autonomous driving, a massive restructure ... » read more

Manufacturing Cyber Security

By Siemens EDA - 03 Mar, 2022 - Comments: 0

Designers and manufacturers worldwide are concerned about manufacturing cyber security and design data when using additive manufacturing technology. This whitepaper from Identify3D discusses how digital product data is shared during the additive manufacturing workflow and how that data might be better secured. Using products from Identify3D and Siemens, the entire additive manufacturing data ch... » read more

Addressing Library Characterization And Verification Challenges Using ML

By Siemens EDA - 23 Feb, 2022 - Comments: 0

At advanced process nodes, Liberty or library (.lib) requirements are more demanding due to design complexities, increased number of corners required for timing signoff, and the need for statistical variation modeling. This results in an increase in size, complexity, and the number of .lib characterizations. Validation and verification of these complex and large .lib files is a challenging task... » read more

SoC Power Methodology: Are We Lean Enough

By Siemens EDA - 09 Feb, 2022 - Comments: 0

It’s interesting how past lessons learned have such relevance in today’s quest for an optimum system-on chip (SoC) power methodology. Lean manufacturing was introduced by the Toyota Motor Corporation in the 1930s. It is now an essential methodology in most manufacturing and industrial settings. As lean methodology evolved, it extended to software development where its principles have led to... » read more

Smart DFT Infrastructure And Automation Are Key To Managing Design Scaling

By Siemens EDA - 08 Feb, 2022 - Comments: 0

This paper describes how using a smarter DFT infrastructure and automation can greatly improve the DFT schedule. A structural DFT infrastructure based on plug-and-play principles is used to enable concurrent DFT development and integration. DFT automation is used to connect and manage the DFT infrastructure to dramatically reduce the risks associated with design scaling and complexity. Highe... » read more

Addressing Library Characterization And Verification Challenges Using ML

By Siemens EDA - 02 Feb, 2022 - Comments: 0

Veloce Coverage App And Veloce Assertion App Deliver Unified Coverage Methodology

By Siemens EDA - 26 Jan, 2022 - Comments: 0

The interoperability of the Veloce Coverage app and the Veloce Assertion app with other verification engines (simulation and formal) enables merging coverage collected by each engine and provides a cohesive coverage closure report and analysis flow. It enables the verification team and product-level management to make important decisions such as coverage closure sign-off, test quality analysis ... » read more

High-Quality Test And Embedded Analytics For Secure Applications

By Siemens EDA - 11 Jan, 2022 - Comments: 0

Designs for secure applications such as smart cards and those used in the defense industry require security to ensure sensitive data is inaccessible to outside agents. This used to be a somewhat niche requirement and the implementation of custom solutions to meet these specific requirements was common. However, with the explosion within the semiconductor industry of automotive and cyber-phys... » read more