Author's Latest Posts

4 Horsemen Of Wire Harness Manufacturing
By Siemens EDA - 03 Mar, 2021 - Comments: 0

Growing demands for automotive electrical and electronic (E/E) features drive increased complexity in the wiring harnesses that carry power and data signals to components around the vehicle. As a result, the wire harness manufacturing industry is expected to see significant growth, expanding into a 91 billion dollar industry in 2025. However, wire harness manufacturers often operate on small pr... » read more

Surviving The Three Phases Of High Density Advanced Packaging Design
By Siemens EDA - 24 Feb, 2021 - Comments: 0

The growth of High Density Advanced Packages (HDAP) such as FOWLP, CoWoS, and WoW is triggering a convergence of the traditional IC design and IC package-design worlds. To handle these various substrate scenarios, process transformation must occur. This paper discusses the three phases of HDAP design and provides tips on how to survive their challenges. To read more, click here. » read more

Using AWS Cloud Services For IC Library Characterization That Is Scalable, Secure, And Fast
By Siemens EDA - 10 Feb, 2021 - Comments: 0

Siemens’ AMS Verification team and Amazon Web Services (AWS) have collaborated to provide users with a scalable, secure and cost-effective cloud characterization flow that enables users to leverage cloud computing resources to accelerate library characterization, reduce compute resource bottlenecks, as well as improve characterization runtime predictability. To read more, click here. » read more

Tessent LogicBIST With Observation Scan Technology
By Siemens EDA - 03 Feb, 2021 - Comments: 0

Meeting the ISO 26262 requirements for high quality and long-term reliability mans implementing on-chip safety mechanisms with high defect coverage of IC logic. This paper describes Observation Scan Technology, a new new logic built-in-self-test (BIST) technology that improves logic BIST test quality and reduces in-system test time. Empirical results demonstrate 90% test coverage with up to 10X... » read more

Streaming Scan Network
By Siemens EDA - 27 Jan, 2021 - Comments: 0

The increasing complexity in large System on Chip (SoC) designs present challenges to design-for-test (DFT). Hierarchical DFT alleviates some of those challenges, by itself, is no longer enough. Adding Tessent Streaming Scan Network (SSN) technology eliminates the difficult and costly trade-offs between test implementation effort and manufacturing test cost by decoupling core-level and chip-lev... » read more

An Integrated Approach To Power Domain And Clock Domain Crossing Verification
By Siemens EDA - 13 Jan, 2021 - Comments: 0

Reducing power consumption is essential for both mobile and data center applications. The challenge is to lower power while minimally impacting performance. The solution has been to partition designs into multiple power domains which allow selectively reducing voltage levels or powering off partitions. Traditional low power verification validates only the functional correctness of power control... » read more

Generative Design For EV Electrical Systems
By Siemens EDA - 06 Jan, 2021 - Comments: 0

Electric vehicles (EVs) are popularly held as the future of personal mobility and transportation. New electric car manufacturers are flooding the market while established OEMs divert more investment to electric vehicle programs in an attempt to stay ahead. Automotive electrical and electronic systems are becoming more complex, and the complexity is beginning to strain conventional design method... » read more

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