Author's Latest Posts


Overcoming The Challenges Of Verifying Multi-Die Systems


Despite clear advantages of multi-die systems, the decision to design a multi-die system rather than a traditional monolithic SoC is not easy. There are numerous new challenges that stand in the way of multi-die system realization. This white paper focuses on the verification challenges of multi-die systems, including: Addressing capacity and performance for system verification Valid... » read more

Ensure Zero Functional CDC Signoff Defects With VC SpyGlass Integrated Solution


This whitepaper will explain how designers can ensure zero defects seamlessly using Synopsys VC SpyGlass as a single cockpit for not just structural CDC analysis but also for complete functional analysis. We will also cover how designers can utilize a single dashboard for tracking the functional CDC signoff progress over the course of the project. Click here to read more. » read more

Advanced Design Planning In IC Compiler II


By Rajiv Dave, CAE Manager, Synopsys. Design exploration and planning is becoming an increasingly critical step of the design creation process as growing constraints and requirements are placed upon it. IC Compiler II has been architected from the ground up with the express focus to address the three key challenges of design planning: Capacity to handle the largest design optimally yet ... » read more

Computational Lithography Solutions To Enable High NA EUV


This white paper identifies and discusses the computational needs required to support the development, optimization, and implementation of high NA extreme ultraviolet (EUV) lithography. It explores the challenges associated with the increased complexity of high NA systems, proposes potential solutions, and highlights the importance of computational lithography in driving the success of advanced... » read more

Early Architecture Performance And Power Analysis Of Multi-Die Systems


A multi-die system is a semiconductor device in which multiple homogeneous or heterogeneous dies are contained within a single package. Multi-die systems have been available for select uses for years, but they are gaining wider popularity and are expected to be used in a wide variety of end applications, including high-performance computing, automotive, and mobile. There are two main factors dr... » read more

Meeting Stringent PA_SaveConfigTime In UFS Solution When M-PHY Needs Higher Reconfigure Time


The JEDEC Universal Flash Storage (UFS) has emerged as the default mobile storage solution for high-end smartphones and battery-operated devices, owing to its superior speed, performance, and power efficiency. These attributes are essential to meet users' demand for rapid transmission and reception of high-resolution media amid myriad operations. Despite these advantages, UFS's use of the MIPI ... » read more

Building A Comprehensive Multicloud Security Strategy: A Zero-Trust Approach


The traditional, perimeter-based security model is no longer sufficient in today’s dynamic, multicloud deployments. A zero-trust (ZT) security model, in which no user or system is inherently trusted, is becoming essential—it is a foundational capability that underpins security for multicloud strategies. The ZT security model operates on the principle of “Never trust. Always verify.” ... » read more

Challenges Facing The Automotive Industry Now And In The Future


The next decade may be the most exciting for the automotive industry, with carmakers, suppliers, and consumers all witnessing changes and advancements coming at breakneck speed. In fact, there will likely be more development of new technologies to power vehicles, make them safer and offer more conveniences and services in the next 10 years than in the previous 50 years. Battery-electric powertr... » read more

Accelerated Optimization With IC Compiler II


Efficient optimization is a necessary, yet challenging aspect of the physical implementation flow. IC Compiler II and the underlying physical optimization engines have been re-thought and re-architected to address these growing challenges. Click here to read more. » read more

Leveraging IBIS-AMI Models To Optimize PCIe 6.0 Designs


The exploding demand for more data driven by advancements such as artificial intelligence and machine learning has created an increase in bandwidth (BW) for interconnects for different systems and hardware components such as graphic cards, network cards, storge devices, CPUs, memories, and many more. PCIe is the leading high-speed serial communication protocol for connecting such hardware compo... » read more

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